公开(公告)号：US20240393705A1

公开(公告)日：2024-11-28

申请号：US18639022

申请日：2024-04-18

Applicant: SEMES CO., LTD.

Inventor： Sang Hyun PARK ,  Seung Hwan LEE ,  Su Jin AHN ,  Geon Yup LIM ,  Jin Ki SHIN ,  Dong Hoon KANG ,  Hyun Soo KIM ,  Kwang Soo KIM ,  Chang Suk OH ,  Young Jun LEE

IPC: G03F7/00 ,  H01L21/67 ,  H01L21/687

Abstract: Disclosed is a substrate processing apparatus in which weight of a buffer module may be reduced compared to the apparatus in the related art. The substrate processing apparatus may include: an index module; a buffer module; a treating module; and an interface module, in which the index module includes: a load port in which a container receiving a substrate is placed; and an index frame provided with an index robot for transferring the substrate between the container placed in the load port and the buffer module, the buffer module includes a buffer unit on which the substrate is placed, the treating module includes: a cooling chamber for cooling the substrate loaded from the buffer module; a liquid treating chamber for liquid treating the substrate loaded from the cooling chamber; a heat treating chamber for heat treating the substrate loaded from the cooling chamber; and a transfer chamber disposed between the liquid treating chamber and the heat treating chamber, and provided with a transfer robot for transferring the substrate to each of the liquid treating chamber, the heat treating chamber, and the cooling chamber, and when viewed from above, the cooling chamber and the buffer unit are provided in non-overlapping positions.

公开(公告)号：US20220139738A1

公开(公告)日：2022-05-05

申请号：US17515737

申请日：2021-11-01

Applicant: SEMES CO., LTD.

Inventor： Jae Oh BANG ,  Young Seo AN ,  Seung Han LEE ,  Seung Hwan LEE ,  Hyun Min KIM

IPC: H01L21/67 ,  H01L21/324 ,  H01L21/66 ,  F27B17/00 ,  F27D7/02 ,  F27D99/00

Abstract: The inventive concept relates to a substrate treating apparatus including a process chamber having a first and a second body, a support unit supporting a substrate, a heating unit heats the substrate, a driver moves any one of the first body and the second body, an interval state detection unit that detects an interval state between a side wall of the first body and a side wall of the second body when the first and the second body are placed in a process location, and a controller that controls the driver and the interval state detection unit, wherein the interval state detection unit includes a pressure provision line that provides a positive pressure or a negative pressure between the side wall of the first body and the side wall of the second body, and a pressure measurement member that measures a change in a pressure of the pressure provision line.

公开(公告)号：US20250096496A1

公开(公告)日：2025-03-20

申请号：US18803641

申请日：2024-08-13

Applicant: SEMES CO., LTD.

Inventor： Jae Oh BANG ,  Min Young KIM ,  Ju Mi LEE ,  Seung Hwan LEE

IPC: H01R13/187 ,  H01L21/687 ,  H01R13/24 ,  H01R107/00

Abstract: An electrical terminal connector, a substrate support, and a substrate processing apparatus are provided. The electrical terminal connector includes a housing unit installed by penetrating through a heater cup and having a housing ring, and a terminal connection unit installed to reciprocate within the housing unit and having a terminal connection portion to or from which an electric terminal is attached and detached. The terminal connection portion is variable so that the electric terminal is insertable when the terminal connection portion is separated from the housing ring and the electric terminal is fixed when the terminal connection portion is inserted into the housing ring together with the inserted electric terminal.

公开(公告)号：US20250068080A1

公开(公告)日：2025-02-27

申请号：US18743089

申请日：2024-06-13

Applicant: SEMES CO., LTD.

Inventor： Kyung Taek IM ,  Jae Ha KIM ,  Seung Hwan LEE ,  Seung Jun LEE

IPC: G03F7/38 ,  H01L21/67

Abstract: Provided is a substrate treatment apparatus including: a cooling chamber accommodating a substrate; and a cooling unit disposed inside the cooling chamber, the cooling unit including a support, two first plates connected to the support to support the substrate and spaced apart from each other in a height direction of the support, and a second plate disposed to move up and down between the two first plates.