公开(公告)号：US10079163B2

公开(公告)日：2018-09-18

申请号：US15196653

申请日：2016-06-29

Applicant: Semes Co., Ltd.

Inventor： Raetaek Oh ,  Hyunwoo Lee

IPC: H01L21/67 ,  B08B3/08 ,  H01L21/02 ,  B08B15/00 ,  B08B3/10 ,  B08B3/14 ,  B08B5/00

CPC classification number: H01L21/67051 ,  H01L21/02052 ,  H01L21/02057 ,  H01L21/67017

Abstract: Disclosed is an apparatus for treating a substrate. The apparatus includes a support unit that supports the substrate, and a treatment liquid supply unit that supplies a treatment liquid to the substrate, and the treatment liquid supply unit includes an injection unit that supplies the treatment liquid to the substrate supported by the support unit, a tank that accommodates the treatment liquid, a pipe connected to the tank, and a static electricity removing member that removes static electricity from the treatment liquid.

公开(公告)号：US10446425B2

公开(公告)日：2019-10-15

申请号：US15655190

申请日：2017-07-20

Applicant: SEMES CO., LTD.

Inventor： Junghwan Lee ,  Raetaek Oh

IPC: B25J15/00 ,  H01L21/673 ,  B65G49/07 ,  H01L21/677 ,  H01L21/687 ,  H01L21/67

Abstract: Disclosed is a substrate treating system. The substrate treating system includes an index unit having a port, on which a container containing a substrate is positioned, and an index robot, a process executing unit having substrate treating apparatuses for treating the substrate and a main transferring robot for transferring the substrate, and a buffer unit disposed between the process executing unit and the index unit and in which the substrate fed between the process executing unit and the index unit temporarily stays. Each of the index robot, the substrate treating apparatuses, the main transferring robot, and the buffer unit includes a conductive part contacting the substrate to remove static electricity of the substrate.

公开(公告)号：US20170018442A1

公开(公告)日：2017-01-19

申请号：US15196653

申请日：2016-06-29

Applicant: Semes Co., Ltd.

Inventor： Raetaek Oh ,  Hyunwoo Lee

IPC: H01L21/67 ,  B08B3/08 ,  H01L21/02 ,  B08B15/00 ,  B08B3/10 ,  B08B3/14 ,  B08B5/00

CPC classification number: H01L21/67051 ,  H01L21/02052 ,  H01L21/02057 ,  H01L21/67017

Abstract: Disclosed is an apparatus for treating a substrate. The apparatus includes a support unit that supports the substrate, and a treatment liquid supply unit that supplies a treatment liquid to the substrate, and the treatment liquid supply unit includes an injection unit that supplies the treatment liquid to the substrate supported by the support unit, a tank that accommodates the treatment liquid, a pipe connected to the tank, and a static electricity removing member that removes static electricity from the treatment liquid.

Abstract translation: 公开了一种处理基板的装置。 该装置包括支撑基板的支撑单元和向基板供给处理液的处理液供给单元，处理液供给单元包括将处理液供给到由支撑单元支撑的基板的注入单元， 容纳处理液体的罐，连接到罐的管以及从处理液中除去静电的静电除去部件。

公开(公告)号：US11171019B2

公开(公告)日：2021-11-09

申请号：US15858120

申请日：2017-12-29

Applicant: SEMES CO., LTD.

Inventor： Jaeyong Kim ,  Raetaek Oh ,  Taekyoub Lee

IPC: H01L21/02 ,  H01L21/67 ,  G01F23/00 ,  B08B3/04

Abstract: Disclosed are an apparatus and a method for treating a substrate. The substrate treating apparatus includes a flow rate measuring unit includes a container located outside the housing and having an accommodation space an upper side of which is opened and in which the treatment liquid discharged from the treatment liquid nozzle is accommodated, in the interior thereof, a measurement member configured to measure an amount of the treatment liquid accommodated in the accommodation space, and a drain line through which the treatment liquid in the container is discharged.

公开(公告)号：US10043682B2

公开(公告)日：2018-08-07

申请号：US15196653

申请日：2016-06-29

Applicant: Semes Co., Ltd.

Inventor： Raetaek Oh ,  Hyunwoo Lee

IPC: H01L21/67 ,  B08B3/08 ,  H01L21/02 ,  B08B15/00 ,  B08B3/10 ,  B08B3/14 ,  B08B5/00

Abstract: Disclosed is an apparatus for treating a substrate. The apparatus includes a support unit that supports the substrate, and a treatment liquid supply unit that supplies a treatment liquid to the substrate, and the treatment liquid supply unit includes an injection unit that supplies the treatment liquid to the substrate supported by the support unit, a tank that accommodates the treatment liquid, a pipe connected to the tank, and a static electricity removing member that removes static electricity from the treatment liquid.