公开(公告)号：US20230197492A1

公开(公告)日：2023-06-22

申请号：US18083558

申请日：2022-12-18

Applicant: SEMES CO., LTD.

Inventor： Duk Hyun SON ,  Je Hee LEE

IPC: H01L21/677 ,  H01L21/687 ,  H01L21/67

CPC classification number: H01L21/67742 ,  H01L21/68707 ,  H01L21/67196

Abstract: A substrate transfer module, which provides clean environment to prevent particles from moving to a substrate, and semiconductor manufacturing equipment including the same. The substrate transfer module of the semiconductor manufacturing equipment includes a transfer chamber providing a transfer space of the substrate, having a chamber groove lowered by a predetermined height from a bottom surface to form a gap with respect to the bottom surface, a guide member provided in an inside portion of the transfer chamber, and a substrate transfer robot configured to move along the guide member and to transfer the substrate.

公开(公告)号：US20210366696A1

公开(公告)日：2021-11-25

申请号：US17327567

申请日：2021-05-21

Applicant: SEMES CO., LTD.

Inventor： Je Hee LEE ,  Sang Kee LEE

IPC: H01J37/32

Abstract: An electrostatic chuck according to the present disclosure includes: a dielectric plate embedded with an electrode and configured to electrostatically hold a substrate; a base plate disposed below the dielectric plate; and a heating unit provided in the base plate and configured to independently heat a plurality of regions of the substrate, such that temperatures of the plurality of regions of the substrate may be independently controlled, thereby improving uniformity of the temperature of the substrate.