公开(公告)号：US20230313374A1

公开(公告)日：2023-10-05

申请号：US18107558

申请日：2023-02-09

Applicant: SEMES CO., LTD.

Inventor： Sun Il KIM ,  Sung Nam YOO ,  Jin Il SUNG

IPC: C23C16/455

CPC classification number: C23C16/45544 ,  C23C16/45527 ,  C23C16/45563

Abstract: A flow velocity increasing device of an apparatus for depositing a thin film includes a device body disposed within the chamber and a flow velocity increasing hole portion formed in the device body and tapered in a direction of gas passage so that a flow velocity of passed gas is faster than that externally.

公开(公告)号：US20240159590A1

公开(公告)日：2024-05-16

申请号：US18507065

申请日：2023-11-12

Applicant: SEMES CO., LTD.

Inventor： Jin Il SUNG ,  Dong Mok LEE ,  Sun Il KIM ,  Ki Ryong LEE

IPC: G01J5/00 ,  H01J37/32

CPC classification number: G01J5/0003 ,  H01J37/32642 ,  G01J2005/0077

Abstract: Proposed is an inspection technology for inspecting a focus ring. A device and a method for inspecting the focus ring including a heat transfer member are proposed. The inspection device may include a housing configured to provide inspection space of the focus ring, with a predetermined area of an upper wall of the housing being formed of a transparent material, a hot plate provided in the housing and configured to heat treat the focus ring while the hot plate supports the focus ring, and an inspection unit configured to inspect a connection state between the focus ring and the heat transfer member by obtaining a thermal image of the focus ring after the focus ring is completely heat treated.

公开(公告)号：US20220139680A1

公开(公告)日：2022-05-05

申请号：US17408383

申请日：2021-08-21

Applicant: SEMES CO., LTD.

Inventor： Dong Mok LEE ,  Jin Il SUNG

IPC: H01J37/32 ,  H01L21/683

Abstract: A substrate processing apparatus and a method of fabricating the same are proposed. A bonding layer, by which a chuck body and a base plate of an electrostatic chuck device are bonded, is completely covered using a double-sealing structure in which a covering member for preventing a processing gas from infiltrating into the bonding layer and a sealing member for preventing the bonding layer from being damaged are bonded to each other. The durability and the efficiency of the operation of the electrostatic chuck device are improved.