公开(公告)号：US20240105492A1

公开(公告)日：2024-03-28

申请号：US18241887

申请日：2023-09-03

Applicant: SEMES CO., LTD.

Inventor： Jong Gun LEE ,  Jin Taek OH

IPC: H01L21/683 ,  G03F7/40 ,  H01L21/324 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/6838 ,  G03F7/40 ,  H01L21/324 ,  H01L21/67109 ,  H01L21/6875

Abstract: Proposed is a thermal processing apparatus, an operation method thereof, and photo spinner equipment having a bake unit as the thermal processing apparatus, capable of uniformly applying heat to the entire area of a substrate by minimizing defamation of the substrate using low vacuum pressure. The thermal processing apparatus includes the base plate provided in a disc shape, a support pin provided on an upper surface of the base plate, a vacuum hole formed through the base plate, and a protruding member provided at a height lower than that of the support pin on the upper surface of the base plate.