公开(公告)号：US20240194517A1

公开(公告)日：2024-06-13

申请号：US18515638

申请日：2023-11-21

Applicant: SEMES CO., LTD.

Inventor： Jaeoh BANG ,  Jumi LEE ,  Minyoung KIM ,  Jong Gun LEE

IPC: H01L21/687 ,  G03F7/40 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/6875 ,  G03F7/40 ,  H01L21/67109 ,  H01L21/6838 ,  H01L21/68742

Abstract: Disclosed is a substrate processing apparatus that allows a substrate to be supported on an ultra-thin heating plate so as to be spaced from the ultra-thin heating plate in a proximity manner. The substrate processing apparatus includes a heating plate for heating a substrate; and a through proximity pin installed in the heating plate so as to pass through a through-hole formed in the heating plate such that the substrate is spaced from the heating plate by a spacing via the through proximity pin.

公开(公告)号：US20240105492A1

公开(公告)日：2024-03-28

申请号：US18241887

申请日：2023-09-03

Applicant: SEMES CO., LTD.

Inventor： Jong Gun LEE ,  Jin Taek OH

IPC: H01L21/683 ,  G03F7/40 ,  H01L21/324 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/6838 ,  G03F7/40 ,  H01L21/324 ,  H01L21/67109 ,  H01L21/6875

Abstract: Proposed is a thermal processing apparatus, an operation method thereof, and photo spinner equipment having a bake unit as the thermal processing apparatus, capable of uniformly applying heat to the entire area of a substrate by minimizing defamation of the substrate using low vacuum pressure. The thermal processing apparatus includes the base plate provided in a disc shape, a support pin provided on an upper surface of the base plate, a vacuum hole formed through the base plate, and a protruding member provided at a height lower than that of the support pin on the upper surface of the base plate.

公开(公告)号：US20220102171A1

公开(公告)日：2022-03-31

申请号：US17486238

申请日：2021-09-27

Applicant: SEMES CO., LTD.

Inventor： Jae Oh BANG ,  Jong Gun LEE

IPC: H01L21/67 ,  H01L21/683

Abstract: The inventive concept provides a substrate treating apparatus. In an embodiment, the substrate treating apparatus includes a process chamber having a treatment space, a support unit that supports a substrate in the treatment space, and a supply line that supplies a process gas into the treatment space, and the support unit includes a heating plate provided with a heater pattern on a lower surface thereof and that heats the supported substrate, and an insulation layer covering the heater pattern and the lower surface of the heating plate.

公开(公告)号：US20240222179A1

公开(公告)日：2024-07-04

申请号：US18525387

申请日：2023-11-30

Applicant: SEMES CO., LTD.

Inventor： So Hyung JIONG ,  Hyung Joon KIM ,  Jong Gun LEE

IPC: H01L21/683 ,  C04B35/645 ,  C04B37/02

CPC classification number: H01L21/6833 ,  C04B35/6455 ,  C04B37/021 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/401 ,  C04B2237/402 ,  C04B2237/403 ,  C04B2237/406

Abstract: A method of manufacturing a susceptor includes preparing an electrostatic chuck (ESC) and a base plate, each including a gas channel, preparing a bush-filter assembly disposed between the gas channel in the ESC and the gas channel in the base plate, and coupling the ESC to the base plate in such a manner that a portion of the bush-filter assembly is accommodated in a first accommodation part formed in a surface of the ESC and that a remaining portion of the bush-filter assembly is at least partially accommodated in a second accommodation part formed in a surface of the base plate.

公开(公告)号：US20240038566A1

公开(公告)日：2024-02-01

申请号：US18088753

申请日：2022-12-26

Applicant: SEMES CO., LTD.

Inventor： Jong Gun LEE ,  Hyung Joon Kim

IPC: H01L21/683

CPC classification number: H01L21/6833

Abstract: A substrate processing apparatus is provided. The substrate processing apparatus includes: a chuck member; a ceramic puck disposed on the chuck member; a focus ring disposed to surround the ceramic puck; an insulating layer disposed below the focus ring to surround the chuck member; and two electrodes formed in the insulating layer, wherein a distance between the two electrodes is adjustable to form a variable capacitance.

公开(公告)号：US20220413397A1

公开(公告)日：2022-12-29

申请号：US17848841

申请日：2022-06-24

Applicant: SEMES CO., LTD.

Inventor： Tae Hoon LEE ,  Jong Gun LEE ,  Ki Sang EUM

IPC: G03F7/20 ,  G03F7/38

Abstract: Provided is a support unit including a support plate on which the substrate is placed, and a support protrusion provided on the support plate and separating the substrate from the support plate, wherein the support plate includes a first protrusion protruding from an upper surface of the support plate, wherein the first protrusion is provided in a support region provided by the support protrusion.

公开(公告)号：US20220206393A1

公开(公告)日：2022-06-30

申请号：US17547309

申请日：2021-12-10

Applicant: SEMES CO., LTD.

Inventor： Jaeoh BANG ,  Jong Gun LEE ,  Tae Hoon LEE

IPC: G03F7/16

Abstract: Disclosed is a method for manufacturing a cooling plate for cooling a substrate, including an operation of manufacturing a coolant pipe by using a tubular pipe, an operation of inserting the coolant pipe into a casting mold that defines a plate, and an operation of casting the cooling plate by injecting a molten metal into the casting mold.