公开(公告)号：US20240222163A1

公开(公告)日：2024-07-04

申请号：US18505474

申请日：2023-11-09

Applicant: SEMES CO., LTD.

Inventor： Ju Won KIM ,  Dongwoon PARK ,  Gi Hun JUNG ,  Byoung Doo CHOI ,  A Rah CHO ,  Jong Hyuk PARK

IPC: H01L21/67 ,  G03F7/38

CPC classification number: H01L21/67115 ,  G03F7/38 ,  H01L21/67225

Abstract: Provided is a substrate processing apparatus that processes a semiconductor substrate using a laser and a semiconductor manufacturing equipment including the same. The substrate processing apparatus comprises a chamber for providing a space where a substrate is processed; a support module disposed within the chamber and for supporting the substrate; and a laser signal generation module disposed in the chamber and for transmitting a laser signal onto the substrate to heat-treat the substrate, wherein the laser signal generation module heat-treats the substrate including a photoresist layer.