公开(公告)号：US20230201863A1

公开(公告)日：2023-06-29

申请号：US18146740

申请日：2022-12-27

Applicant: SEMES CO., LTD.

Inventor： Eunwoo PARK ,  Jongwha KANG ,  Wooram LEE ,  Sung-Gyu LEE ,  Dongwoon PARK ,  Yongdae CHO ,  Donghoon KANG ,  Kisang EUM

IPC: B05C5/02

CPC classification number: B05C5/0275 ,  B05C5/0208

Abstract: Provided is an apparatus for processing a substrate. The substrate processing apparatus includes: a processing unit processing a substrate; and a gas supply unit supplying gas to the processing unit, in which the gas supply unit includes a first housing having a first internal space which is in fluid communication with a processing space of the processing unit, a second housing disposed in the first internal space, and having a second internal space which is in fluid communication with the first internal space, and a gas supply duct supplying the gas to the second internal space.

公开(公告)号：US20230215745A1

公开(公告)日：2023-07-06

申请号：US17990819

申请日：2022-11-21

Applicant: SEMES CO., LTD.

Inventor： Woo Sin JUNG ,  Young CHOI ,  Dae Sung KIM ,  Hae Kyung KIM ,  Dongwoon PARK

IPC: H01L21/67

CPC classification number: H01L21/6715

Abstract: A liquid trap tank and a liquid supply unit for the liquid trap tank are provided. The liquid trap tank includes a tank body which has an accommodating space formed therein to accommodate a liquid and has an inlet portion formed on one side and an outlet portion formed on an opposite side; and a liquid supply unit coupled to the inlet of the tank body to supply the liquid from the outside of the tank body to the accommodating space, wherein the liquid supply unit comprises an inlet pipe portion coupled to the inlet portion to introduce the liquid into the accommodating space and a flow directing portion connected to the inlet pipe portion and configured to induce a flow of the liquid to suppress generation of air bubbles due to a drop of the liquid passing through the inlet pipe portion.

公开(公告)号：US20230051256A1

公开(公告)日：2023-02-16

申请号：US17885865

申请日：2022-08-11

Applicant: SEMES CO., LTD.

Inventor： Sung-Gyu LEE ,  Jung-Hyun LEE ,  Hye Bin BAEK ,  Dae Woon LEE ,  Dongwoon PARK

IPC: G03F7/16

Abstract: Disclosed is an apparatus for treating a substrate, which includes: a first unit configured to perform a coating process of forming a film on a substrate; a transfer unit including a transfer robot transferring a substrate for which the coating process is terminated; and a controller controlling the first unit and the transfer unit, in which the controller controls the substrate for which the coating process is terminated in the first unit to rotate at a first rotational velocity until the substrate is transferred by the transfer unit.

公开(公告)号：US20240203757A1

公开(公告)日：2024-06-20

申请号：US18500963

申请日：2023-11-02

Applicant: SEMES CO., LTD.

Inventor： Hyeong Og MUN ,  Dongwoon PARK ,  Doo Young OH ,  Jae Ho YOO

IPC: H01L21/67

CPC classification number: H01L21/67017

Abstract: There are provided a control unit and semiconductor manufacturing equipment including the same, which control a damper installed in a main exhaust duct based on exhaust volumes measured from individual exhaust ducts connected to respective units. The semiconductor manufacturing equipment includes: a damper installed in a main exhaust pipe; a first unit treating a substrate and connected to the main exhaust pipe through a first auxiliary exhaust pipe; a second unit treating the substrate and connected to the main exhaust pipe through a second auxiliary exhaust pipe; and a control unit controlling the first and second units, wherein the control unit controls the damper based on exhaust volumes from the first and second units.

公开(公告)号：US20240222163A1

公开(公告)日：2024-07-04

申请号：US18505474

申请日：2023-11-09

Applicant: SEMES CO., LTD.

Inventor： Ju Won KIM ,  Dongwoon PARK ,  Gi Hun JUNG ,  Byoung Doo CHOI ,  A Rah CHO ,  Jong Hyuk PARK

IPC: H01L21/67 ,  G03F7/38

CPC classification number: H01L21/67115 ,  G03F7/38 ,  H01L21/67225

Abstract: Provided is a substrate processing apparatus that processes a semiconductor substrate using a laser and a semiconductor manufacturing equipment including the same. The substrate processing apparatus comprises a chamber for providing a space where a substrate is processed; a support module disposed within the chamber and for supporting the substrate; and a laser signal generation module disposed in the chamber and for transmitting a laser signal onto the substrate to heat-treat the substrate, wherein the laser signal generation module heat-treats the substrate including a photoresist layer.