公开(公告)号：US20230201844A1

公开(公告)日：2023-06-29

申请号：US18145952

申请日：2022-12-23

Applicant: SEMES CO., LTD

Inventor： A Rah CHO ,  Woo Sin JUNG ,  Hae Kyung KIM ,  Dae Sung KIM

IPC: B05B1/00 ,  B05B12/08 ,  B05B15/20 ,  B05B15/50

CPC classification number: B05B1/005 ,  B05B12/088 ,  B05B15/20 ,  B05B15/50

Abstract: Provided is an equipment for treating a substrate. The substrate treating equipment may include: a nozzle supplying a chemical solution to a substrate; and a chemical solution supply apparatus supplying the chemical solution to the nozzle, and the chemical solution supply apparatus may include a pump member, an extraction nozzle provided on a flow path through which the chemical solution is introduced into the pump member and spraying the chemical solution by a spray scheme, and a control unit controlling an operation of the pump member.

公开(公告)号：US20230073867A1

公开(公告)日：2023-03-09

申请号：US17940207

申请日：2022-09-08

Applicant: SEMES CO., LTD. ,  SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION

Inventor： Jung Suk GOH ,  A Rah CHO ,  Woo Sin JUNG ,  Dae Sung KIM ,  Hae Kyung KIM ,  Hyungmin PARK ,  Jungjin LEE ,  Linfeng PIAO ,  Jubeom LEE

IPC: G03F7/16

Abstract: Provided is a liquid supplying apparatus including: a trap tank for receiving a liquid from a storage bottle in which the liquid is stored and accommodating the received liquid; a pipe for connecting the storage bottle and the trap tank; and a valve installed on the pipe and for opening and closing a flow path of the pipe, in which the valve is installed closer to the storage bottle than the trap tank.

公开(公告)号：US20230073468A1

公开(公告)日：2023-03-09

申请号：US17902094

申请日：2022-09-02

Applicant: SEMES CO., LTD. ,  SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION

Inventor： Jung Suk GOH ,  A Rah CHO ,  Hyungmin PARK ,  Linfeng PIAO ,  Jubeom LEE ,  Jungjin LEE

IPC: G01N15/00 ,  G03F7/16

Abstract: The inventive concept relates to an apparatus for treating a substrate. The apparatus includes a liquid supply unit that supplies a liquid to a substrate, a cover that is formed of a light transmitting material and installed on a component provided in the liquid supply unit and that provides an inspection area, and an inspection unit that inspects bubbles contained in the liquid flowing in the component provided in the inspection area. The inspection unit includes a light source that applies light toward the inspection area from outside the cover, a light receiving part that is located outside the cover and that receives the light passing through the inspection area, and an inspection part that inspects the bubbles from the light received by the light receiving part.

公开(公告)号：US20240222163A1

公开(公告)日：2024-07-04

申请号：US18505474

申请日：2023-11-09

Applicant: SEMES CO., LTD.

Inventor： Ju Won KIM ,  Dongwoon PARK ,  Gi Hun JUNG ,  Byoung Doo CHOI ,  A Rah CHO ,  Jong Hyuk PARK

IPC: H01L21/67 ,  G03F7/38

CPC classification number: H01L21/67115 ,  G03F7/38 ,  H01L21/67225

Abstract: Provided is a substrate processing apparatus that processes a semiconductor substrate using a laser and a semiconductor manufacturing equipment including the same. The substrate processing apparatus comprises a chamber for providing a space where a substrate is processed; a support module disposed within the chamber and for supporting the substrate; and a laser signal generation module disposed in the chamber and for transmitting a laser signal onto the substrate to heat-treat the substrate, wherein the laser signal generation module heat-treats the substrate including a photoresist layer.

公开(公告)号：US20240017284A1

公开(公告)日：2024-01-18

申请号：US18138038

申请日：2023-04-22

Applicant: SEMES CO., LTD.

Inventor： Dae Sung KIM ,  Jae Hyun LIM ,  Kyo Sang YOON ,  Ho Jin JANG ,  A Rah CHO

IPC: B05C9/08

CPC classification number: B05C9/08

Abstract: An apparatus for processing a substrate includes a processing vessel disposed in a process chamber and including a processing space in which a substrate is accommodated; a liquid supply line configured to process the substrate by supplying processing liquid to the substrate in the processing space; an exhaust line connected to the processing vessel and configured to exhaust gas in the processing space; a spraying portion disposed on the exhaust line and configured to spray cleaning liquid to remove contaminants accumulated in the exhaust line; and a washing liquid discharge line branched from the exhaust line and including a suction portion therein to suction cleaning liquid waste including contaminants removed from the exhaust line by the cleaning liquid and to discharge the cleaning liquid waste to the outside.