SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD

    公开(公告)号:US20250079197A1

    公开(公告)日:2025-03-06

    申请号:US18815987

    申请日:2024-08-27

    Abstract: Disclosed are an apparatus for treating a substrate and a method of treating a substrate using a supercritical fluid. The apparatus includes: a chamber for providing a treatment space for treating a substrate; and a treatment fluid supply unit for supplying a treatment fluid to the treatment space, in which treatment fluid supply unit includes: a tank for storing the treatment fluid; a heating unit for heating the treatment fluid in the tank to convert the treatment fluid from a first state to a second state; an inlet line for introducing the treatment fluid in the first state into the tank; a supply line for supplying the treatment fluid of the second state from the tank to the chamber; a circulation line for circulating the treatment fluid in the tank; a first valve installed in the circulation line; and a temperature drop member installed in the circulation line to lower a temperature of the treatment fluid flowing through the circulation line.

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