公开(公告)号：US20240006160A1

公开(公告)日：2024-01-04

申请号：US18142442

申请日：2023-05-02

Applicant: SEMES CO., LTD.

Inventor： Kwangryul KIM ,  Yunsang KIM

IPC: H01J37/32 ,  B23K26/352

CPC classification number: H01J37/32449 ,  H01J37/32568 ,  H01J37/32082 ,  B23K26/352 ,  H01J2237/002 ,  H01J2237/334

Abstract: Provided is a substrate processing apparatus including a chamber including a processing space; a support table provided within the processing space of the chamber and configured to support a substrate; a dielectric plate covering an opening in an upper wall of the chamber; a transparent electrode provided on the dielectric plate; a laser supply head configured to supply a laser beam toward the substrate supported on the support table via the transparent electrode and the dielectric plate; and a cooling device configured to cool the transparent electrode by injecting a cooling gas toward the transparent electrode.