公开(公告)号：US20230307266A1

公开(公告)日：2023-09-28

申请号：US17704218

申请日：2022-03-25

Applicant: SEMES CO., LTD.

Inventor： Kyung Man KIM ,  Jeong Woo HAN ,  Ji-hwan LEE ,  Wan Jae PARK ,  Yoon Jong JU ,  Seong Hak BAE

IPC: H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67103 ,  H01L21/67248 ,  H01L21/6833

Abstract: The present invention provides a support unit, including: a support plate on which a substrate is placed, and which includes an electrostatic electrode providing electrostatic force to the substrate; a heater provided inside the support plate and configured to heat the substrate; an insulating plate provided under the support plate as an insulating substance; and a bimetal member disposed inside the support plate and configured to compensate for bending of the support plate due to heat, in which the bimetal member includes: a pin provided to be in contactable with a bottom surface of the substrate that is placed on the support plate; a first member configured to support the pin; and a second member provided to surround the first member, and the pin is provided to move up or move down according to a difference in the amount of thermal deformation between the first member and the second member.