公开(公告)号：US20180033632A1

公开(公告)日：2018-02-01

申请号：US15655055

申请日：2017-07-20

Applicant: SEMES CO., LTD.

Inventor： SOYOUNG PARK ,  HEEHWAN KIM

IPC: H01L21/304 ,  B08B3/04 ,  B08B3/02 ,  B08B3/10 ,  H01L21/67 ,  B08B3/08

CPC classification number: H01L21/304 ,  B08B3/02 ,  B08B3/047 ,  B08B3/08 ,  B08B3/10 ,  H01L21/67051

Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a spin head configured to support the substrate, a cup surrounding an outer circumference of the spin head, a first ejection member having a first nozzle configured to discharge a first chemical to the substrate located in the spin head, and a second ejection member having a second nozzle configured to discharge a second chemical of the same chemical composition as that of the first chemical to the substrate located in the spin head.