公开(公告)号：US20180033655A1

公开(公告)日：2018-02-01

申请号：US15657137

申请日：2017-07-22

Applicant: SEMES CO., LTD.

Inventor： HEEHWAN KIM ,  YOUNG HUN LEE

IPC: H01L21/67 ,  B08B7/00 ,  B08B3/08 ,  H01L21/02 ,  H01L21/687

CPC classification number: H01L21/67051 ,  B08B3/08 ,  B08B7/0021 ,  H01L21/02057 ,  H01L21/02101 ,  H01L21/67028 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67207 ,  H01L21/68735

Abstract: Disclosed are an apparatus and a method for treating a substrate. The method includes supplying a mixture liquid obtained by mixing an additive with an organic solvent onto a substrate, and after the supplying of the mixture liquid, removing the mixture liquid from the substrate by supplying a supercritical fluid to the substrate and dissolving the mixture liquid in the supercritical fluid, wherein the additive has a surface tension that is lower than that of the organic solvent and a boiling point that is lower than that of the organic solvent.

公开(公告)号：US20180033632A1

公开(公告)日：2018-02-01

申请号：US15655055

申请日：2017-07-20

Applicant: SEMES CO., LTD.

Inventor： SOYOUNG PARK ,  HEEHWAN KIM

IPC: H01L21/304 ,  B08B3/04 ,  B08B3/02 ,  B08B3/10 ,  H01L21/67 ,  B08B3/08

CPC classification number: H01L21/304 ,  B08B3/02 ,  B08B3/047 ,  B08B3/08 ,  B08B3/10 ,  H01L21/67051

Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a spin head configured to support the substrate, a cup surrounding an outer circumference of the spin head, a first ejection member having a first nozzle configured to discharge a first chemical to the substrate located in the spin head, and a second ejection member having a second nozzle configured to discharge a second chemical of the same chemical composition as that of the first chemical to the substrate located in the spin head.

公开(公告)号：US20190189471A1

公开(公告)日：2019-06-20

申请号：US16224891

申请日：2018-12-19

Applicant: SEMES CO., LTD.

Inventor： BUYOUNG JUNG ,  JONGHAN KIM ,  YOUNG JIN JANG ,  JIN TACK YU ,  YOUNGJUN CHOI ,  DAEHUN KIM ,  BYUNGSUN BANG ,  JONGHYEON WOO ,  HEEHWAN KIM ,  CHEOL-YONG SHIN ,  GUI SU PARK

IPC: H01L21/67 ,  H01L21/683

Abstract: Disclosed are a standby port and a substrate processing apparatus having the same. The standby port exhausts fumes generated when a processing liquid is discharged into the standby port before the supply of the processing liquid onto a substrate, thereby preventing pollution of a chamber atmosphere.

公开(公告)号：US20170345687A1

公开(公告)日：2017-11-30

申请号：US15604141

申请日：2017-05-24

Applicant: SEMES CO., LTD.

Inventor： HEEHWAN KIM ,  YOUNG HUN LEE

IPC: H01L21/67 ,  B08B3/14 ,  B08B3/08 ,  H01L21/02 ,  B01D46/00

CPC classification number: H01L21/67051 ,  H01L21/02101 ,  H01L21/67017 ,  H01L21/6719

Abstract: Provided is an apparatus and method for supplying a fluid. The substrate treating apparatus comprises a treating unit for treating a substrate and a fluid supply unit for supplying fluid to the treating unit, wherein the fluid supply unit comprises a supply tank in which the fluid is stored, a supply line connecting the supply tank and the treating unit to supply the fluid from the supply tank to the treating unit, a filter installed on the supply line, and an exhaust line branching from the supply line, wherein a branch point of the exhaust line in the supply line is located upstream of the filter.