公开(公告)号：US20220208589A1

公开(公告)日：2022-06-30

申请号：US17555302

申请日：2021-12-17

Applicant: SEMES CO., LTD.

Inventor： Se Min KANG ,  Gu Yeol AN

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/677

Abstract: An apparatus and a method of reducing the replacement cycle due to abrasion of chuck pins that support a lateral surface of a substrate are proposed. A substrate gripping apparatus for gripping the substrate in substrate processing equipment includes a chuck, a gear box configured to be movable with respect to the chuck, a rotation gear provided inside the gear box, chuck pins configured to be rotatable while being coupled to the rotation gear and to be brought into contact with a lateral surface of the substrate. According to the embodiment of the present disclosure, the substrate is configured such that the lateral surface thereof is supported by various positions of each of the chuck pins. Therefore, the life of the chuck pins can be improved and maintenance costs can be reduced.

公开(公告)号：US20240207906A1

公开(公告)日：2024-06-27

申请号：US18475488

申请日：2023-09-27

Applicant: SEMES CO., LTD.

Inventor： Sang Gun LEE ,  Young Joon HAN ,  Se Min KANG ,  Ju Ha WOO ,  In Ki JUNG ,  Jeong Hyup YU

IPC: B08B3/08

CPC classification number: B08B3/08 ,  H01L21/67023

Abstract: A substrate processing apparatus includes a support unit supporting a substrate, a rear nozzle unit installation unit including a sidewall surrounding the support unit and forming an internal space, a rear nozzle unit including a rear nozzle movably disposed outside of the sidewall to supply liquid toward a rear surface of the substrate and a rear nozzle driving unit connected to the rear nozzle through a partial sidewall portion of the sidewall in the internal space and driving the rear nozzle to move, and a liquid inflow preventing unit disposed on the partial sidewall portion of the sidewall and including an isolation space isolated from the internal space.