公开(公告)号：US20240066564A1

公开(公告)日：2024-02-29

申请号：US18126949

申请日：2023-03-27

Applicant: SEMES CO., LTD.

Inventor： Do Hyung KIM ,  Dae Hun KIM ,  Young Jin KIM ,  Tae Ho KANG ,  Young Joon HAN ,  Eun Hyeok CHOI ,  Jun Gwon LEE

IPC: B08B5/02 ,  B08B3/02 ,  B08B13/00

CPC classification number: B08B5/02 ,  B08B3/022 ,  B08B13/00 ,  F26B21/004

Abstract: Proposed are a substrate processing apparatus and a substrate processing method capable of efficiently preventing contamination of a substrate and a processing space caused by a reverse flow of purge gas.

公开(公告)号：US20230194422A1

公开(公告)日：2023-06-22

申请号：US18080552

申请日：2022-12-13

Applicant: SEMES CO., LTD.

Inventor： Seung Tae YANG ,  Sang Woo PARK ,  Young Joon HAN ,  Gi Hun CHOI ,  Moon Soon CHOI ,  Seong Hyeon KIM ,  Bu Young JUNG

IPC: G01N21/3577 ,  B01L3/00

CPC classification number: G01N21/3577 ,  B01L3/502 ,  G01N2021/3595

Abstract: A chemical liquid supply unit includes a chemical liquid storage storing a chemical liquid, a chemical liquid supply line that is connected to the chemical liquid storage, the chemical liquid flowing through the chemical liquid supply line from the chemical liquid storage, and a chemical liquid inspection means detecting impurities from the chemical liquid flowing through the chemical liquid supply line using a spectroscopy method.

公开(公告)号：US20230215741A1

公开(公告)日：2023-07-06

申请号：US17972666

申请日：2022-10-25

Applicant: SEMES CO., LTD.

Inventor： Young Joon HAN ,  Gi Hun CHOI ,  Seung Tae YANG ,  Sang Woo PARK ,  Seong Hyeon KIM ,  Bu Young JUNG

IPC: H01L21/67

CPC classification number: H01L21/67051 ,  H01L21/67103

Abstract: A substrate processing apparatus includes a nozzle unit including a nozzle tip discharging liquid to a substrate; and a liquid supply line supplying the liquid to the nozzle unit, wherein the liquid supply line includes a liquid supply pipe connected to the nozzle tip; a supply valve installed in the liquid supply pipe; and a heater disposed between the nozzle tip and the supply valve in the liquid supply pipe.

公开(公告)号：US20240207906A1

公开(公告)日：2024-06-27

申请号：US18475488

申请日：2023-09-27

Applicant: SEMES CO., LTD.

Inventor： Sang Gun LEE ,  Young Joon HAN ,  Se Min KANG ,  Ju Ha WOO ,  In Ki JUNG ,  Jeong Hyup YU

IPC: B08B3/08

CPC classification number: B08B3/08 ,  H01L21/67023

Abstract: A substrate processing apparatus includes a support unit supporting a substrate, a rear nozzle unit installation unit including a sidewall surrounding the support unit and forming an internal space, a rear nozzle unit including a rear nozzle movably disposed outside of the sidewall to supply liquid toward a rear surface of the substrate and a rear nozzle driving unit connected to the rear nozzle through a partial sidewall portion of the sidewall in the internal space and driving the rear nozzle to move, and a liquid inflow preventing unit disposed on the partial sidewall portion of the sidewall and including an isolation space isolated from the internal space.

公开(公告)号：US20240203777A1

公开(公告)日：2024-06-20

申请号：US18545660

申请日：2023-12-19

Applicant: SEMES CO., LTD.

Inventor： In Ki JUNG ,  Jeong Hyup YU ,  Young Joon HAN ,  Sung Bum PARK ,  Sung Wook BAE

IPC: H01L21/68

CPC classification number: H01L21/68 ,  H01L21/6708

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chuck supporting a substrate; a liquid supply unit configured to supply a liquid to a substrate supported on the chuck; a treating container surrounding the substrate supported on the chuck; and an eccentricity correction unit configured to correct an eccentricity of the substrate supported on the chuck, and wherein the eccentricity correction unit contacts a plurality of points on a side end of the substrate supported on the chuck to match a center of the substrate with a center of the chuck.

公开(公告)号：US20250153208A1

公开(公告)日：2025-05-15

申请号：US18935860

申请日：2024-11-04

Applicant: SEMES CO., LTD.

Inventor： Sang Hu HAN ,  Young Joon HAN ,  Cheol Hwan JEONG ,  Ju Ha WOO

IPC: B05B12/08 ,  B08B3/02

Abstract: Disclosed is an apparatus for processing a substrate, the apparatus including: a cup providing a processing space; a support unit provided in the processing space, and for supporting a substrate; a support unit provided in the processing space, and for supporting a substrate; a liquid supply unit including a nozzle for discharging a liquid to the substrate; a position adjuster coupled to the nozzle and for adjusting a position of the nozzle; and an adjustment unit coupled to the support unit, and for detecting pressure data when the liquid discharged from the nozzle meets the adjustment unit and position information at which the pressure data is generated.

公开(公告)号：US20240210166A1

公开(公告)日：2024-06-27

申请号：US18385909

申请日：2023-11-01

Applicant: SEMES CO., LTD.

Inventor： In Ki JUNG ,  Jeong Hyup YU ,  Young Joon HAN ,  Sung Bum PARK

IPC: G01B11/24

CPC classification number: G01B11/24

Abstract: A method for monitoring performance of an eccentricity correction unit, the method includes a first operation of measuring eccentricity of a substrate mounted on a support unit and storing an amount of eccentricity correction corrected by the eccentricity correction unit such that measured eccentricity of the substrate is within a preset allowable eccentricity value, and a second operation of monitoring, based on the stored amount of eccentricity correction, performance degradation of the eccentricity correction unit.

公开(公告)号：US20240399429A1

公开(公告)日：2024-12-05

申请号：US18442486

申请日：2024-02-15

Applicant: SEMES CO., LTD.

Inventor： Ju Ha WOO ,  Young Joon HAN ,  Sang Hu HAN

IPC: B08B15/02 ,  B08B3/08

Abstract: Provided is a substrate processing apparatus and a substrate processing method that are capable of increasing exhaust volume without increasing exhaust facilities. An apparatus for processing a substrate includes: a processing chamber having a processing space for processing a substrate; a support unit for supporting the substrate in the processing space; a liquid supply unit for supplying a liquid to a substrate supported by the support unit; and an exhaust unit for exhausting the processing space, in which the exhaust unit includes: an exhaust pipe connected to the processing space; and an exhaust amplifier installed in the exhaust pipe and for supplying acceleration gas to a passage of the exhaust pipe to amplify an exhaust flow rate of exhaust gas flowing in the exhaust pipe.

公开(公告)号：US20230207355A1

公开(公告)日：2023-06-29

申请号：US18145538

申请日：2022-12-22

Applicant: SEMES CO., LTD.

Inventor： Kun Hee PARK ,  Young Joon HAN ,  Cheol Hwan JEONG ,  Dae Hun KIM ,  Seong Hyun YUN ,  Ye Jin CHOI ,  Eun Hyeok CHOI ,  Tae Ho KANG ,  Young Jin KIM

IPC: H01L21/67 ,  H01L21/687 ,  B08B13/00 ,  B08B3/02 ,  B08B1/00 ,  B08B1/02 ,  B25J15/00 ,  B25J11/00

CPC classification number: H01L21/67207 ,  H01L21/67178 ,  H01L21/67196 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/68764 ,  H01L21/68707 ,  B08B13/00 ,  B08B3/022 ,  B08B1/002 ,  B08B1/02 ,  B25J15/0052 ,  B25J11/0085

Abstract: An apparatus for treating a substrate of the present invention includes a buffer unit, an inversion unit, a first transfer chamber, a second transfer chamber, a first cleaning chamber, and a second cleaning chamber. The first transfer chamber, the inversion unit, and the second transfer chamber are sequentially arranged in one direction. The first cleaning chamber is disposed at one side of the first transfer chamber, and the second cleaning chamber is disposed at one side of the second transfer chamber. A first main transfer robot provided in the first transfer chamber directly transfers the substrate between the buffer unit, the inversion unit, and the first cleaning chamber. The second main transfer robot provided in the second transfer chamber directly transfers the substrate between the buffer unit, the inversion unit, and the second cleaning chamber.

公开(公告)号：US20230100773A1

公开(公告)日：2023-03-30

申请号：US17946153

申请日：2022-09-16

Applicant: SEMES CO., LTD.

Inventor： Gi Hun CHOI ,  Young Joon HAN

IPC: B08B3/02 ,  B08B13/00

Abstract: The substrate treating apparatus includes a liquid supply unit for supplying a treating liquid to a substrate supported by a support unit, the liquid supply unit includes a nozzle member for discharging the treating liquid; and a driving member for moving the nozzle member to a standby position and a process position, the nozzle member includes a body having a buffer space and a discharge port configured to discharge the treating liquid; and a rotation member for changing the body between a first state and a second state by a rotation, the first state is a state at which a treating liquid filled in the buffer space is maintained so the treating liquid does not flow to the discharge port, and the second state is a state at which the treating liquid filled in the buffer space is discharged to an outside of the body through the discharge port.