公开(公告)号：US20190115224A1

公开(公告)日：2019-04-18

申请号：US16158728

申请日：2018-10-12

Applicant: SEMES CO., LTD.

Inventor： Youngil LEE ,  Jungbong CHOI ,  Seungho LEE ,  Gui Su PARK ,  Gil Hun SONG ,  Seung Hoon OH ,  Jonghan KIM

IPC: H01L21/311 ,  H01L21/306 ,  H01L21/02 ,  H01L21/67

Abstract: A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a support member to support a substrate, a treatment liquid nozzle to supply a treatment liquid to the substrate positioned on the support member, and a controller to control the treatment liquid nozzle such that the treatment liquid supplied to the substrate is differently discharged in a low-flow-supply section and a high-flow-supply section in which an average discharge amount per hour is more than an average discharge amount per hour in the low-flow-supply section.

公开(公告)号：US20210013047A1

公开(公告)日：2021-01-14

申请号：US17030514

申请日：2020-09-24

Applicant: SEMES CO., LTD.

Inventor： Youngil LEE ,  Jungbong CHOI ,  Seungho LEE ,  Gui Su PARK ,  Gil Hun SONG ,  Seung Hoon OH ,  Jonghan KIM

IPC: H01L21/311 ,  H01L21/67 ,  H01L21/02 ,  H01L21/306 ,  H01L21/687

Abstract: A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a support member to support a substrate, a treatment liquid nozzle to supply a treatment liquid to the substrate positioned on the support member, and a controller to control the treatment liquid nozzle such that the treatment liquid supplied to the substrate is differently discharged in a low-flow-supply section and a high-flow-supply section in which an average discharge amount per hour is more than an average discharge amount per hour in the low-flow-supply section.