METHOD AND APPARATUS FOR TREATING SUBSTRATE

    公开(公告)号:US20220310415A1

    公开(公告)日:2022-09-29

    申请号:US17665233

    申请日:2022-02-04

    Abstract: A substrate treating method includes moving a first component of a substrate treatment device to a preset position in response to a treating process of the substrate treatment device, detecting, by a plurality of position detection sensors, a position of the first component, vision-testing, by a vision sensor, a positional state of the first component, and determining an operational state of an error in the detection of the plurality of position detection sensors or a malfunction of the substrate treatment device based on a detection result obtained by the plurality of position detection sensor and a test result obtained by the vision sensor.

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