公开(公告)号：US20230215742A1

公开(公告)日：2023-07-06

申请号：US17986894

申请日：2022-11-15

Applicant: SEMES CO., LTD.

Inventor： Young Jun SON ,  Tae Hoon LEE ,  Sung Gyu LEE ,  Hyun YOON ,  Do Yeon KIM

IPC: H01L21/67 ,  B01D35/02

CPC classification number: H01L21/67051 ,  B01D35/02

Abstract: A substrate processing apparatus includes: a nozzle unit configured to discharge a processing liquid to a substrate; a pipe connected to the nozzle unit and a processing liquid supply unit supplying the processing liquid; a charge amount control unit disposed at the pipe, including a filter unit charged with positive charges or negative charges, and including at least one of a control valve, controlling a flow rate of the processing liquid passing through an inside of the filter unit, and a power supply unit, applying a voltage to the filter unit, to control a charge amount of the processing liquid; and a control unit connected to the charge amount control unit.