公开(公告)号：US20230317504A1

公开(公告)日：2023-10-05

申请号：US18086633

申请日：2022-12-21

Applicant: SEMES CO., LTD.

Inventor： Tae Hoon LEE

IPC: H01L21/687 ,  B25J18/00

CPC classification number: H01L21/68707 ,  B25J18/00

Abstract: Provided is a robotic arm includes an arm body; and a plurality of pads connected to the arm body and in contact with a substrate, wherein the arm body includes a ceramic plate and an antistatic coating layer disposed on an external surface of the ceramic plate, wherein the pad includes a first conductive layer, and wherein a conductive portion connecting the pad to the antistatic coating layer on an external side of the pad is provided.

公开(公告)号：US20230207341A1

公开(公告)日：2023-06-29

申请号：US18146723

申请日：2022-12-27

Applicant: SEMES CO., LTD.

Inventor： Do Yeon KIM ,  Young Jun SON ,  Tae Hoon LEE ,  Sung-gyu LEE ,  Hyun YOON

IPC: H01L21/67

CPC classification number: H01L21/67051 ,  H01L21/67242 ,  H01L21/6715

Abstract: Provided is an apparatus for treating a substrate. The substrate treating apparatus may include: a substrate support unit supporting a substrate; a nozzle supplying a liquid to the substrate supported on the substrate support unit; a home port in which the nozzle waits; and an electrostatic measurement member measuring an electrostatic amount of a liquid dispensed from the nozzle in the home port.

公开(公告)号：US20230205088A1

公开(公告)日：2023-06-29

申请号：US18146606

申请日：2022-12-27

Applicant: SEMES CO.,LTD

Inventor： Do Yeon KIM ,  Tae Hoon LEE

IPC: G03F7/16

CPC classification number: G03F7/162

Abstract: Provided is an apparatus and a method for liquid-treating a substrate. A substrate treating apparatus may include: a substrate support unit supporting a substrate; and a liquid supply unit applying a photosensitive liquid onto the substrate supported on the substrate support unit, and the liquid supply unit may include an application nozzle supplying the photosensitive liquid, a nozzle arm in which the application nozzle is positioned at one end portion, and a driving member positioned at the other end portion of the nozzle arm and moving the nozzle arm, and the application nozzle may include a nozzle body supported on the nozzle arm, a nozzle tip connected to the nozzle body, and an anti-static surface having an internal flow path through which the photosensitive liquid is ejected and capable of removing static electricity, a nozzle nut member fastened to a thread of the nozzle body so that the nozzle tip is fixed to the nozzle body, and contacting the nozzle tip, and a grounding member having one end contacting the nozzle nut member and the other end grounded through the nozzle arm.

公开(公告)号：US20230215742A1

公开(公告)日：2023-07-06

申请号：US17986894

申请日：2022-11-15

Applicant: SEMES CO., LTD.

Inventor： Young Jun SON ,  Tae Hoon LEE ,  Sung Gyu LEE ,  Hyun YOON ,  Do Yeon KIM

IPC: H01L21/67 ,  B01D35/02

CPC classification number: H01L21/67051 ,  B01D35/02

Abstract: A substrate processing apparatus includes: a nozzle unit configured to discharge a processing liquid to a substrate; a pipe connected to the nozzle unit and a processing liquid supply unit supplying the processing liquid; a charge amount control unit disposed at the pipe, including a filter unit charged with positive charges or negative charges, and including at least one of a control valve, controlling a flow rate of the processing liquid passing through an inside of the filter unit, and a power supply unit, applying a voltage to the filter unit, to control a charge amount of the processing liquid; and a control unit connected to the charge amount control unit.

公开(公告)号：US20230195030A1

公开(公告)日：2023-06-22

申请号：US18084381

申请日：2022-12-19

Applicant: SEMES CO., LTD.

Inventor： Young Jun SON ,  Tae Hoon LEE ,  Hyun YOON ,  Do Yeon KIM

IPC: G03G21/18 ,  G03G15/02 ,  G03G15/00

CPC classification number: G03G21/1842 ,  G03G15/0233 ,  G03G15/60 ,  G03G15/80 ,  G03G2215/0872 ,  G03G2221/0084 ,  G03G2221/1651

Abstract: Proposed are a home port and a substrate processing apparatus using the same. The home port is installed in the substrate processing apparatus to temporarily mount a nozzle for discharging a process liquid to a substrate, and includes a main body having a space therein, a nozzle holder provided at an upper portion of the main body and configured to mount the nozzle, an inclined surface formed below the nozzle holder in the space, a first supply pipe configured to discharge a rinse liquid to a tip of the nozzle, a second supply pipe configured to inject the rinse liquid into the main body, a conductive wire configured to electrically connect the inclined surface and the first supply pipe, and a first switch installed on the conductive wire.

公开(公告)号：US20230194175A1

公开(公告)日：2023-06-22

申请号：US18083898

申请日：2022-12-19

Applicant: SEMES CO., LTD.

Inventor： Young Jun SON ,  Young Jun LEE ,  Ki Sang EUM ,  Tae Hoon LEE

IPC: F27D9/00

CPC classification number: F27D9/00 ,  F27D2009/001 ,  F27D2009/0056 ,  F27D2009/0051 ,  F27D2009/0005 ,  F27D2009/0029

Abstract: Proposed are a chilling unit, a heat treatment apparatus including same, and a heat treatment method. More particularly, proposed is a technology capable of rapidly and effectively lowering the temperature of a heating plate by bringing a heat exchange medium of a chilling unit into contact with the heating plate and then circulating a refrigerant after performing a heat treatment process of a substrate through a heat treatment apparatus.

公开(公告)号：US20220139756A1

公开(公告)日：2022-05-05

申请号：US17513002

申请日：2021-10-28

Applicant: SEMES CO., LTD.

Inventor： Tae Hoon LEE ,  Ju Won KIM ,  Jin Sung SUN ,  Bo Hee LEE

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/677

Abstract: The inventive concept provides a transfer hand for transferring a substrate. The transfer hand for transferring the substrate comprises: a body; and a vacuuma assembly installed in the body and providing decompression to the bottom surface of a substrate to support the substrate at the upper part of the body; wherein the vacuum assembly comprises: an vacuum pad with conductivity contacting the substrate; and a sealing member provided between the vacuum pad and the body, the sealing member electrically connected to the vacuum pad; wherein the sealing member is grounded.

公开(公告)号：US20230207342A1

公开(公告)日：2023-06-29

申请号：US18146800

申请日：2022-12-27

Applicant: SEMES CO., LTD.

Inventor： Young Jun SON ,  Tae Hoon LEE ,  Do Yeon KIM

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67051 ,  H01L21/6715 ,  H01L21/67253 ,  H01L21/68764

Abstract: Provided is an apparatus for treating a substrate. The substrate treating apparatus according to an exemplary embodiment may include: a support unit supporting a substrate; a treating container covering an outer side of the support unit; a liquid supply unit including a nozzle ejecting a liquid to the substrate supported on the support unit; and a home port which is positioned outside the treating container, and in which the nozzle waits, and the home port may include a body having a discharge space to which the liquid ejected from the nozzle is discharged therein, and a measurement unit connected to the body and measuring a charging amount of the liquid discharged from the discharge space.

公开(公告)号：US20220413397A1

公开(公告)日：2022-12-29

申请号：US17848841

申请日：2022-06-24

Applicant: SEMES CO., LTD.

Inventor： Tae Hoon LEE ,  Jong Gun LEE ,  Ki Sang EUM

IPC: G03F7/20 ,  G03F7/38

Abstract: Provided is a support unit including a support plate on which the substrate is placed, and a support protrusion provided on the support plate and separating the substrate from the support plate, wherein the support plate includes a first protrusion protruding from an upper surface of the support plate, wherein the first protrusion is provided in a support region provided by the support protrusion.

公开(公告)号：US20220206393A1

公开(公告)日：2022-06-30

申请号：US17547309

申请日：2021-12-10

Applicant: SEMES CO., LTD.

Inventor： Jaeoh BANG ,  Jong Gun LEE ,  Tae Hoon LEE

IPC: G03F7/16

Abstract: Disclosed is a method for manufacturing a cooling plate for cooling a substrate, including an operation of manufacturing a coolant pipe by using a tubular pipe, an operation of inserting the coolant pipe into a casting mold that defines a plate, and an operation of casting the cooling plate by injecting a molten metal into the casting mold.