SUBSTRATE PROCESSING APPARATUS AND THE METHOD THEREOF

    公开(公告)号:US20230068295A1

    公开(公告)日:2023-03-02

    申请号:US17870840

    申请日:2022-07-22

    Abstract: A substrate processing apparatus and a substrate processing method are provided, which can improve the yield by minimizing the occurrence of stains. The substrate processing method includes forming on the substrate a plurality of ink patterns spaced apart from each other by jetting ink onto the substrate by using a plurality of nozzles, calculating the density of each of the plurality of ink patterns, and selecting at least one nozzle for jetting ink into one pixel area based on respectively calculated densities of the plurality of ink patterns.

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