公开(公告)号：US20230068295A1

公开(公告)日：2023-03-02

申请号：US17870840

申请日：2022-07-22

Applicant: SEMES CO., LTD.

Inventor： Sung Ho KIM ,  Yoon Ok Jang ,  Bo Yeon Hwang ,  Hyun Min Lee ,  Kwang Jun Choi

IPC: B41J2/16 ,  B41J2/205 ,  B41J2/21

Abstract: A substrate processing apparatus and a substrate processing method are provided, which can improve the yield by minimizing the occurrence of stains. The substrate processing method includes forming on the substrate a plurality of ink patterns spaced apart from each other by jetting ink onto the substrate by using a plurality of nozzles, calculating the density of each of the plurality of ink patterns, and selecting at least one nozzle for jetting ink into one pixel area based on respectively calculated densities of the plurality of ink patterns.

公开(公告)号：US12291029B2

公开(公告)日：2025-05-06

申请号：US17945089

申请日：2022-09-15

Applicant: SEMES CO., LTD.

Inventor： Sung Ho Kim ,  Bo Yeon Hwang ,  Chang Jin Moon ,  Sol Min Park ,  Sang Seok Kim

IPC: B41J2/04 ,  B41J2/045 ,  B41M3/00 ,  B41M5/00

Abstract: The present disclosure provides a method for processing a substrate that can maintain a production amount even when a production model is changed. The method for processing a substrate comprises: disposing the substrate on a levitation stage; measuring a distance between the substrate and an inkjet head module; and changing a discharging speed of ink to be discharged from the inkjet head module based on the measured distance.

公开(公告)号：US12011934B2

公开(公告)日：2024-06-18

申请号：US17870840

申请日：2022-07-22

Applicant: SEMES CO., LTD.

Inventor： Sung Ho Kim ,  Yoon Ok Jang ,  Bo Yeon Hwang ,  Hyun Min Lee ,  Kwang Jun Choi

IPC: B41J2/205 ,  B41J2/21

CPC classification number: B41J2/2054 ,  B41J2/2132 ,  B41J2/2142

Abstract: A substrate processing apparatus and a substrate processing method are provided, which can improve the yield by minimizing the occurrence of stains. The substrate processing method includes forming on the substrate a plurality of ink patterns spaced apart from each other by jetting ink onto the substrate by using a plurality of nozzles, calculating the density of each of the plurality of ink patterns, and selecting at least one nozzle for jetting ink into one pixel area based on respectively calculated densities of the plurality of ink patterns.