公开(公告)号：US20230207341A1

公开(公告)日：2023-06-29

申请号：US18146723

申请日：2022-12-27

Applicant: SEMES CO., LTD.

Inventor： Do Yeon KIM ,  Young Jun SON ,  Tae Hoon LEE ,  Sung-gyu LEE ,  Hyun YOON

IPC: H01L21/67

CPC classification number: H01L21/67051 ,  H01L21/67242 ,  H01L21/6715

Abstract: Provided is an apparatus for treating a substrate. The substrate treating apparatus may include: a substrate support unit supporting a substrate; a nozzle supplying a liquid to the substrate supported on the substrate support unit; a home port in which the nozzle waits; and an electrostatic measurement member measuring an electrostatic amount of a liquid dispensed from the nozzle in the home port.