公开(公告)号：US20210111042A1

公开(公告)日：2021-04-15

申请号：US17132008

申请日：2020-12-23

Applicant: SEMES CO., LTD.

Inventor： Boong KIM ,  Oh Jin KWON ,  Sungho JANG ,  Joo Jib PARK

IPC: H01L21/67 ,  F26B25/14 ,  H01L21/677 ,  H01L21/687

Abstract: Provided are an apparatus and method for treating a substrate. Specifically, provided are an apparatus and method for treating a substrate through a supercritical process. The apparatus includes: a housing providing a space for performing a process; a support member disposed in the housing to support a substrate; a supply port configured to supply a process fluid to the housing; a shield member disposed between the supply port and the support member to prevent the process fluid from being directly injected to the substrate; and an exhaust port configured to discharge the process fluid from the housing.