公开(公告)号：US20230201884A1

公开(公告)日：2023-06-29

申请号：US18068917

申请日：2022-12-20

Applicant: SEMES CO, LTD.

Inventor： Yong Hyun CHOI ,  Young Hun LEE ,  Seung Hoon OH ,  Mi So PARK ,  Tae Jong CHOI ,  Yong Sun KO ,  Jin Woo JUNG

IPC: B08B3/02 ,  F26B5/00

CPC classification number: B08B3/022 ,  F26B5/005 ,  H01L21/02057

Abstract: The present invention provides a method for treating a substrate. The method for treating a substrate comprises: treating the substrate with liquid; and drying the liquid-treated substrate, and the liquid treatment step includes: a first liquid supply step of supplying a first liquid to an upper surface of the rotating substrate; and a second liquid supply step of supplying a second liquid to an upper surface of the rotating substrate, and in the second liquid supply step, a rotation speed of the substrate is adjusted such that the second liquid supplied on the substrate flows from a central region of the substrate to an edge region of the substrate.

公开(公告)号：US20250132172A1

公开(公告)日：2025-04-24

申请号：US18918497

申请日：2024-10-17

Applicant: SEMES CO., LTD.

Inventor： Tae Jong CHOI ,  Yong Hee LEE ,  Jong Doo LEE

IPC: H01L21/67 ,  H01L21/02

Abstract: Disclosed is an apparatus for processing a substrate, the apparatus including: a body providing a processing space; a supply line for supplying a drying fluid that removes a treatment fluid on a substrate supported in the processing space; an exhaust line for exhausting an atmosphere of the processing space; and a fluid circulation unit connected with the exhaust line and the supply line, in which the fluid circulation unit includes: a separator for separating the treatment fluid and the drying fluid from a mixed fluid in which the treatment fluid and the drying fluid exhausted from the processing space are mixed; and a liquid reuse line connected to the separator, and for withdrawing, from the separator, the treatment fluid separated from the separator.

公开(公告)号：US20250006513A1

公开(公告)日：2025-01-02

申请号：US18676894

申请日：2024-05-29

Applicant: SEMES CO., LTD.

Inventor： Yong Hee LEE ,  Tae Jong CHOI ,  Mi So PARK

IPC: H01L21/67

Abstract: Disclosed is an apparatus for processing a substrate, the apparatus including: a body providing a processing space; a first fluid supply line connected to the body and supplying treatment fluid to the processing space; a second fluid supply line connected to the body at a location different from the first fluid supply line and supplying treatment fluid to the processing space; a first supply valve installed in the first fluid supply line; and an air removal line having one end connected to the first fluid supply line in a lower stream than the first supply valve to allow air in the processing space that is introduced into the first fluid supply line to be removed from the first fluid supply line when the second fluid supply line supplies treatment fluid to the processing space.