公开(公告)号：US20230201884A1

公开(公告)日：2023-06-29

申请号：US18068917

申请日：2022-12-20

Applicant: SEMES CO, LTD.

Inventor： Yong Hyun CHOI ,  Young Hun LEE ,  Seung Hoon OH ,  Mi So PARK ,  Tae Jong CHOI ,  Yong Sun KO ,  Jin Woo JUNG

IPC: B08B3/02 ,  F26B5/00

CPC classification number: B08B3/022 ,  F26B5/005 ,  H01L21/02057

Abstract: The present invention provides a method for treating a substrate. The method for treating a substrate comprises: treating the substrate with liquid; and drying the liquid-treated substrate, and the liquid treatment step includes: a first liquid supply step of supplying a first liquid to an upper surface of the rotating substrate; and a second liquid supply step of supplying a second liquid to an upper surface of the rotating substrate, and in the second liquid supply step, a rotation speed of the substrate is adjusted such that the second liquid supplied on the substrate flows from a central region of the substrate to an edge region of the substrate.

公开(公告)号：US20220305536A1

公开(公告)日：2022-09-29

申请号：US17667459

申请日：2022-02-08

Applicant: SEMES CO., LTD.

Inventor： Sang Min LEE ,  Seung Hoon OH ,  Yong Joon IM ,  Hyo Won YANG

IPC: B08B13/00 ,  B08B3/04 ,  F26B5/00

Abstract: A substrate processing apparatus includes a process chamber including a first body and a second body that are coupled to each other to form a processing space therein, a clamping member configured to clamp the first body and the second body, and an anti-friction member mounted in a groove formed in a contact region between the first body or the second body and the clamping member.

公开(公告)号：US20240142171A1

公开(公告)日：2024-05-02

申请号：US18099388

申请日：2023-01-20

Applicant: SEMES CO., LTD.

Inventor： Seung Hoon OH ,  Ji Hyeong LEE ,  Jin Se PARK ,  Yong Joon IM ,  Young Hun LEE ,  Yong Sun KO

IPC: F26B5/00 ,  F26B21/10 ,  F26B25/00 ,  F26B25/16 ,  G03F7/16

CPC classification number: F26B5/005 ,  F26B21/10 ,  F26B25/003 ,  F26B25/16 ,  G03F7/168

Abstract: A substrate treating apparatus of the present disclosure comprises: a chamber member having an accommodation space configured to accommodate a vessel part where a substrate treatment region constituting a supercritical treatment space are formed, and an opening configured to move the substrate inside or outside; a shutter configured to open or close the chamber member; and a first exhaust part configured to discharge an internal air from the accommodation space to the outside, wherein the temperature of the substrate treatment region is increased.

公开(公告)号：US20230035940A1

公开(公告)日：2023-02-02

申请号：US17874933

申请日：2022-07-27

Applicant: SEMES CO., LTD.

Inventor： Jong Doo LEE ,  Seung Hoon OH ,  Jin Mo JAE ,  Ki Bong KIM ,  Young Hun LEE

IPC: H01L21/67

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a body; a fluid supply unit for supplying a treating fluid to a treating space within the body; and a fluid exhaust line for exhausting the treating fluid from the treating space, and wherein the body includes: a first body; a second body relatively moving with respect to the first body; and an anti-friction member for preventing a friction between the first body and the second body, and wherein the anti-friction member is configured continuously cover at least two surfaces among surfaces of the first body and the second body.

公开(公告)号：US20190115224A1

公开(公告)日：2019-04-18

申请号：US16158728

申请日：2018-10-12

Applicant: SEMES CO., LTD.

Inventor： Youngil LEE ,  Jungbong CHOI ,  Seungho LEE ,  Gui Su PARK ,  Gil Hun SONG ,  Seung Hoon OH ,  Jonghan KIM

IPC: H01L21/311 ,  H01L21/306 ,  H01L21/02 ,  H01L21/67

Abstract: A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a support member to support a substrate, a treatment liquid nozzle to supply a treatment liquid to the substrate positioned on the support member, and a controller to control the treatment liquid nozzle such that the treatment liquid supplied to the substrate is differently discharged in a low-flow-supply section and a high-flow-supply section in which an average discharge amount per hour is more than an average discharge amount per hour in the low-flow-supply section.

公开(公告)号：US20230129923A1

公开(公告)日：2023-04-27

申请号：US17971734

申请日：2022-10-24

Applicant: SEMES CO., LTD.

Inventor： Jin Woo JUNG ,  Jin Mo JAE ,  Sang Min LEE ,  Young Hun LEE ,  Yong Hyun CHOI ,  Yong Joon IM ,  Seung Hoon OH

IPC: H01L21/687 ,  H01L21/67 ,  B08B3/04 ,  B08B13/00

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing for providing a treating space for treating a substrate within; a support unit for supporting the substrate in the treating space; a bottom supply port for supplying a process fluid to the treating space; and a filler member positioned below the substrate supported on the support unit in the treating space, and wherein the filler member forms a buffer space facing the bottom supply port, and a passage is formed between the filler member and an inner wall of the housing and flows the process fluid which is introduced to the buffer space in a direction of the substrate.

公开(公告)号：US20220390172A1

公开(公告)日：2022-12-08

申请号：US17826936

申请日：2022-05-27

Applicant: SEMES CO., LTD.

Inventor： Jin Mo JAE ,  Seung Hoon OH

IPC: F26B5/00

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing an inner space; a fluid supply unit configured to supply a drying fluid to the inner space; and a fluid exhaust unit configured to exhaust the drying fluid from the inner space, and wherein the fluid exhaust unit includes an exhaust line connected to the chamber; a pressure adjusting member installed at the exhaust line and configured to maintain a pressure of the inner space at a set pressure; and a heating member installed at the pressure adjusting member or a back end of the pressure adjusting member.

公开(公告)号：US20210013047A1

公开(公告)日：2021-01-14

申请号：US17030514

申请日：2020-09-24

Applicant: SEMES CO., LTD.

Inventor： Youngil LEE ,  Jungbong CHOI ,  Seungho LEE ,  Gui Su PARK ,  Gil Hun SONG ,  Seung Hoon OH ,  Jonghan KIM

IPC: H01L21/311 ,  H01L21/67 ,  H01L21/02 ,  H01L21/306 ,  H01L21/687

Abstract: A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a support member to support a substrate, a treatment liquid nozzle to supply a treatment liquid to the substrate positioned on the support member, and a controller to control the treatment liquid nozzle such that the treatment liquid supplied to the substrate is differently discharged in a low-flow-supply section and a high-flow-supply section in which an average discharge amount per hour is more than an average discharge amount per hour in the low-flow-supply section.

公开(公告)号：US20240145263A1

公开(公告)日：2024-05-02

申请号：US18099856

申请日：2023-01-20

Applicant: SEMES CO., LTD.

Inventor： Seung Hoon OH ,  Ki Bong KIM ,  Jong Doo LEE ,  Young Hun LEE ,  Mi So PARK ,  Jin Se PARK ,  Yong Sun KO

IPC: H01L21/67

CPC classification number: H01L21/67034

Abstract: According to an aspect of the present disclosure, there is provided a substrate treating apparatus comprising: a vessel part having a substrate treatment region formed therein and including a supply port through which a treating fluid is supplied to the substrate treatment region and an exhaust port through which the treating fluid is exhausted from the substrate treatment region; a fluid supply unit configured to supply the treating fluid to the substrate treatment region; an exhaust unit configured to exhaust the treating fluid from the vessel part. The exhaust unit comprises: a main line connected to the exhaust port; an extension line branched from at least one of first and second nodes of the main line and including at least one of a first orifice or a first check valve to control an exhaust speed; and an auxiliary line branched from a third node of the main line, where an orifice and a check valve are not formed. During a first process time, the treating fluid is discharged through the extension line, and the treating fluid is not discharged through the auxiliary line, and during a second process time, the treating fluid is discharged through the auxiliary line.

公开(公告)号：US20220186379A1

公开(公告)日：2022-06-16

申请号：US17503741

申请日：2021-10-18

Applicant: SEMES CO., LTD.

Inventor： Jin Mo JAE ,  Seung Hoon OH ,  Young Seop CHOI ,  Mi So PARK ,  Jong Hyeon WOO

IPC: C23C18/16

Abstract: An apparatus for treating a substrate includes a vessel having a sealable process space formed therein in which the substrate is accommodated, a supply port that is provided inside a wall of the vessel and that supplies a process fluid into the process space, an exhaust port provided inside the wall of the vessel and spaced apart from the supply port, and a buffer member provided in the process space, the buffer member being provided in a position overlapping with the supply port and the exhaust port when viewed from above. The buffer member includes a sidewall portion that is located outward of the supply port and the exhaust port and that makes contact with the wall of the vessel and an upper wall portion having a through-hole formed therein to correspond to a center of the substrate, the through-hole forming a straight flow path in an up/down direction.