公开(公告)号：US20240145261A1

公开(公告)日：2024-05-02

申请号：US18407848

申请日：2024-01-09

Applicant: SEMES CO., LTD.

Inventor： Eui Sang LIM ,  Young Hun LEE ,  Jinwoo JUNG ,  Miso PARK ,  Byongwook AHN ,  Yong Hee LEE

IPC: H01L21/67 ,  H01J37/32

CPC classification number: H01L21/67017 ,  H01J37/32449 ,  H01J37/32467 ,  H01J37/32715 ,  H01J37/32834 ,  H01J2237/334

Abstract: The apparatus includes a support unit to support the substrate in a treatment space of a process chamber, a first fluid supply unit to supply a supercritical fluid having an organic solvent dissolved in the supercritical fluid, to the treatment space, a second fluid supply unit to supply the supercritical fluid having no organic solvent dissolved in the supercritical fluid, to the treatment space, an exhaust unit to exhaust the treatment space, a controller to control the first fluid supply unit, the second fluid supply unit, and the exhaust unit. The controller controls the first and second fluid supply units such that the supercritical fluid having no organic solvent dissolved in the supercritical fluid is supplied to the treatment space through the second fluid supply unit, after the supercritical fluid mixed with the organic solvent is supplied to the treatment space through the first fluid supply unit.

公开(公告)号：US20140238443A1

公开(公告)日：2014-08-28

申请号：US14190534

申请日：2014-02-26

Applicant: Semes Co., Ltd.

Inventor： Se Won LEE ,  Yong Hee LEE ,  Jae Yong KIM

IPC: H01L21/02

CPC classification number: H01L21/02052 ,  H01L21/67051 ,  H01L21/6708

Abstract: Provided is a substrate treatment apparatus. The apparatus includes a chuck supporting a substrate and being rotatable, a container surrounding the chuck and collecting chemicals scattered due to rotations of the substrate, and a first spray nozzle spraying the chemicals to the substrate.

Abstract translation: 提供了一种基板处理装置。 该装置包括支撑基板并且可旋转的卡盘，围绕卡盘的容器和收集由于基底的旋转而散射的化学药品以及将化学品喷洒到基底上的第一喷嘴。

公开(公告)号：US20220013372A1

公开(公告)日：2022-01-13

申请号：US17370469

申请日：2021-07-08

Applicant: SEMES CO., LTD.

Inventor： Miso PARK ,  Yong Hee LEE ,  Dohyeon YOON

IPC: H01L21/67 ,  B08B7/00 ,  B08B7/04 ,  H05B3/30 ,  F27B17/00 ,  F27D5/00 ,  H05B1/02

Abstract: The inventive concept provides an apparatus for treating a substrate by using a supercritical fluid. In an embodiment, the apparatus may include a process chamber that provides a treatment space, and including a chamber heater that increases a temperature of an interior of the treatment space, a substrate support provided in the treatment space and that supports the substrate, and a substrate heating member that heats a lower surface of the substrate while contacting the lower surface of the substrate.

公开(公告)号：US20220020609A1

公开(公告)日：2022-01-20

申请号：US17370475

申请日：2021-07-08

Applicant: SEMES CO., LTD.

Inventor： Miso PARK ,  Yong Hee LEE ,  Eui Sang LIM ,  Jinwoo JUNG

IPC: H01L21/67 ,  H01L21/02 ,  B08B7/00 ,  B08B13/00

Abstract: An apparatus for treating a substrate using a treating fluid in a supercritical state is provided. In a pressure increasing step of increasing a pressure in the treating space from a pressure lower than a critical pressure of the treating fluid to a treating pressure higher than the critical pressure, the apparatus controls a supply amount of the treating fluid supplied from a first supply port to control flow of the treating fluid supplied from the first supply port and then exhausted through an exhaust port.

公开(公告)号：US20210104418A1

公开(公告)日：2021-04-08

申请号：US17061622

申请日：2020-10-02

Applicant: Semes Co., Ltd

Inventor： Miso PARK ,  Yong Hee LEE

IPC: H01L21/67 ,  B08B7/00

Abstract: An apparatus for treating a substrate is provided. The apparatus for treating the substrate includes a high pressure chamber to provide a treatment space to perform a process of treating the substrate using a process fluid, a fluid supply source to provide the process fluid to the high pressure chamber, a fluid supply unit to supply the process fluid to the treatment space of the high pressure chamber, an exhaust unit to exhaust the process fluid in the high pressure chamber, and a pre-vent unit to vent a process fluid remaining inside a supply line.

公开(公告)号：US20250006513A1

公开(公告)日：2025-01-02

申请号：US18676894

申请日：2024-05-29

Applicant: SEMES CO., LTD.

Inventor： Yong Hee LEE ,  Tae Jong CHOI ,  Mi So PARK

IPC: H01L21/67

Abstract: Disclosed is an apparatus for processing a substrate, the apparatus including: a body providing a processing space; a first fluid supply line connected to the body and supplying treatment fluid to the processing space; a second fluid supply line connected to the body at a location different from the first fluid supply line and supplying treatment fluid to the processing space; a first supply valve installed in the first fluid supply line; and an air removal line having one end connected to the first fluid supply line in a lower stream than the first supply valve to allow air in the processing space that is introduced into the first fluid supply line to be removed from the first fluid supply line when the second fluid supply line supplies treatment fluid to the processing space.

公开(公告)号：US20240170305A1

公开(公告)日：2024-05-23

申请号：US18425816

申请日：2024-01-29

Applicant: SEMES CO., LTD.

Inventor： Jin Woo JUNG ,  Do Hyeon YOON ,  Yong Hee LEE

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/677

CPC classification number: H01L21/67028 ,  H01L21/02101 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/67739

Abstract: A substrate processing apparatus includes a substrate cleaning unit cleaning a substrate, a substrate drying unit drying the substrate, and a transfer robot transferring the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit includes a substrate processing container having a substrate processing space accommodating the substrate, and the transfer robot includes a surface temperature measurement sensor measuring a surface temperature of the substrate processing container.

公开(公告)号：US20220367221A1

公开(公告)日：2022-11-17

申请号：US17745116

申请日：2022-05-16

Applicant: SEMES CO., LTD.

Inventor： Do Hyeon YOON ,  Yong Hee LEE ,  Jin Woo JUNG ,  Mi So PARK

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/677 ,  B08B3/08 ,  B08B13/00 ,  F26B5/00

Abstract: The present invention provides a substrate treating apparatus. The substrate treating apparatus includes: a liquid treatment chamber configured to treat a substrate with a liquid; a drying chamber configured to dry the liquid-treated substrate; a transfer robot configured to transfer the substrate between the liquid treatment chamber and the drying chamber, and including a hand which is movable along an X-axis, a Y-axis, and a Z-axis and is rotatably driven based on the Z-axis, and on which the substrate is placed; an optical system configured to photograph a form of a liquid film of the substrate, in which when the substrate is transferred from the liquid treatment chamber to the drying chamber, the substrate is wetted with a chemical liquid and is transferred by the transfer robot in a state of being formed with a liquid film formed; and a controller configured to measure the form of the liquid film photographed by the optical system.

公开(公告)号：US20220208565A1

公开(公告)日：2022-06-30

申请号：US17520826

申请日：2021-11-08

Applicant: SEMES CO., LTD.

Inventor： Jin Woo JUNG ,  Do Hyeon YOON ,  Yong Hee LEE

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/677

Abstract: A substrate processing apparatus includes a substrate cleaning unit cleaning a substrate, a substrate drying unit drying the substrate, and a transfer robot transferring the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit includes a substrate processing container having a substrate processing space accommodating the substrate, and the transfer robot includes a surface temperature measurement sensor measuring a surface temperature of the substrate processing container.

公开(公告)号：US20130319457A1

公开(公告)日：2013-12-05

申请号：US13905634

申请日：2013-05-30

Applicant: Semes Co., Ltd.

Inventor： Yong Hee LEE ,  Bok Kyu LEE ,  Jongsu CHOI

IPC: H01L21/02

CPC classification number: H01L21/02041 ,  H01L21/02052 ,  H01L21/67051

Abstract: Provided are an apparatus and a method of cleaning a substrate. The apparatus includes a substrate supporting unit supporting a substrate, a container surrounding the substrate supporting unit and collecting an organic solvent scattered from the substrate, and a fluid supplying unit provided on one side of the container and spraying a liquid organic solvent with bubbles to the substrate. The fluid supplying unit includes a nozzle head ejecting the organic solvent to the substrate, an organic solvent supplying line supplying the organic solvent from an organic solvent storage tank to the nozzle head, and a bubble providing element provided on the organic solvent supplying line and providing bubbles to the liquid organic solvent.

Abstract translation: 提供一种清洗基板的装置和方法。 该装置包括支撑基板的基板支撑单元，围绕基板支撑单元并收集从基板散射的有机溶剂的容器以及设置在容器的一侧上的流体供给单元，并且向液体有机溶剂喷射气泡 基质。 流体供给单元包括将有机溶剂喷射到基板的喷嘴头，将有机溶剂从有机溶剂容器供给到喷嘴头的有机溶剂供给管线和设置在有机溶剂供给管线上的气泡供给元件， 气泡到液体有机溶剂。