公开(公告)号：US20240136157A1

公开(公告)日：2024-04-25

申请号：US18381151

申请日：2023-10-16

Applicant: SEMES CO., LTD.

Inventor： Je Ho KIM ,  Tae Suk JUNG

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687

CPC classification number: H01J37/32633 ,  H01J37/3244 ,  H01L21/67069 ,  H01L21/67103 ,  H01L21/6833 ,  H01L21/68742 ,  H01J2237/334

Abstract: Proposed is a substrate processing apparatus, including a housing configured to provide a processing space therein, a substrate support unit configured to support a substrate within the processing space, and a baffle unit provided to surround a circumference of the substrate support unit. The baffle unit includes a baffle plate provided to surround the circumference of the substrate support unit and having at least one slit therein, and a drive member that lifts and moves the baffle plate, and the housing is provided in a shape capable of changing a size of a space between the processing space and the baffle plate according to a lifting movement of the baffle plate.

公开(公告)号：US20240234100A9

公开(公告)日：2024-07-11

申请号：US18381151

申请日：2023-10-17

Applicant: SEMES CO., LTD.

Inventor： Je Ho KIM ,  Tae Suk JUNG

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687

CPC classification number: H01J37/32633 ,  H01J37/3244 ,  H01L21/67069 ,  H01L21/67103 ,  H01L21/6833 ,  H01L21/68742 ,  H01J2237/334

Abstract: Proposed is a substrate processing apparatus, including a housing configured to provide a processing space therein, a substrate support unit configured to support a substrate within the processing space, and a baffle unit provided to surround a circumference of the substrate support unit. The baffle unit includes a baffle plate provided to surround the circumference of the substrate support unit and having at least one slit therein, and a drive member that lifts and moves the baffle plate, and the housing is provided in a shape capable of changing a size of a space between the processing space and the baffle plate according to a lifting movement of the baffle plate.