SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD
    1.
    发明申请
    SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD 有权
    基板处理装置和基板处理方法

    公开(公告)号:US20130108975A1

    公开(公告)日:2013-05-02

    申请号:US13665169

    申请日:2012-10-31

    CPC classification number: H01L21/67017 Y10T137/8593

    Abstract: Provided is a substrate treating apparatus. The substrate treating apparatus includes a chamber, a support member disposed within the chamber to support a substrate, and an exhaust member for exhausting a gas within an inner space of the chamber to the outside of the chamber. A trap space for collecting fumes contained in the gas is defined in the exhaust member.

    Abstract translation: 提供了一种基板处理装置。 基板处理装置包括室,设置在室内以支撑基板的支撑构件以及用于将腔室的内部空间内的气体排出到室外的排气构件。 在排气构件中限定用于收集气体中所含的烟雾的捕集空间。

    NOZZLE APPARATUS, APPARATUS AND METHOD FOR TREATING SUBSTRATE

    公开(公告)号:US20210001357A1

    公开(公告)日:2021-01-07

    申请号:US16918341

    申请日:2020-07-01

    Abstract: An apparatus for performing liquid treatment for a substrate is provided. The apparatus for performing the liquid treatment for the substrate may include a housing having a treatment space, a substrate support unit to support and rotate the substrate in the treatment space, a liquid feeding unit including a nozzle device including a central exhaust port and multiple first outer exhaust ports, which are provided in a shape of a ring to form a concentric circle with the central exhaust port to feed mutually different treating liquids onto the substrate through respective exhaust ports, and a controller to control the liquid feeding unit.

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