公开(公告)号：US20210001357A1

公开(公告)日：2021-01-07

申请号：US16918341

申请日：2020-07-01

Applicant: SEMES CO., LTD.

Inventor： Chang Suk OH ,  Woo Sin JUNG ,  UnKyu KANG

IPC: B05B1/16 ,  B08B7/04 ,  B08B3/08 ,  B05B15/555 ,  G03F7/16

Abstract: An apparatus for performing liquid treatment for a substrate is provided. The apparatus for performing the liquid treatment for the substrate may include a housing having a treatment space, a substrate support unit to support and rotate the substrate in the treatment space, a liquid feeding unit including a nozzle device including a central exhaust port and multiple first outer exhaust ports, which are provided in a shape of a ring to form a concentric circle with the central exhaust port to feed mutually different treating liquids onto the substrate through respective exhaust ports, and a controller to control the liquid feeding unit.

公开(公告)号：US20240157391A1

公开(公告)日：2024-05-16

申请号：US18382525

申请日：2023-10-22

Applicant: SEMES CO., LTD.

Inventor： Sung Jin BANG ,  Chang Suk OH

IPC: B05C5/02

CPC classification number: B05C5/027 ,  B05C5/0208

Abstract: Proposed is a substrate treating apparatus. The substrate treating apparatus includes a treating container having a treating space therein, a support unit supporting and rotate a substrate in the treating space, and a liquid supply unit supplying a treating liquid onto the substrate, wherein the liquid supply unit may include a nozzle member and an actuator for moving the nozzle member, wherein the nozzle member may include nozzles arranged along a first direction so that the nozzles form a first row and nozzles coupled to the body and arranged along the first direction so that the nozzles form a second row, wherein the first row and the second row may be spaced apart from each other in a second direction perpendicular to the first direction when viewed from above. At this time, the nozzles constituting the nozzle member may be observed as a whole from the front.

公开(公告)号：US20220075280A1

公开(公告)日：2022-03-10

申请号：US17465293

申请日：2021-09-02

Applicant: SEMES CO., LTD.

Inventor： Kisang EUM ,  Chang Suk OH ,  Sang Eun NOH

IPC: G03F7/20 ,  B08B9/093 ,  B08B13/00

Abstract: The inventive concept relates to a substrate treating apparatus, and may include a substrate treating apparatus includes a rotatable spin head, a cup that surrounds the spin head, a cleaning jig seated on the spin head, and that discharges a cleaning liquid toward the cup through rotation of the spin head, and a nozzle unit located at an upper portion of the cleaning jig and that supplies the cleaning liquid to a center of an upper surface of the cleaning jig, and the cleaning jig includes spattering guide grooves formed to be recessed such that the cleaning liquid provided from the nozzle unit spatters toward the cup with a centrifugal force due to the rotation of the spin head.

公开(公告)号：US20240393705A1

公开(公告)日：2024-11-28

申请号：US18639022

申请日：2024-04-18

Applicant: SEMES CO., LTD.

Inventor： Sang Hyun PARK ,  Seung Hwan LEE ,  Su Jin AHN ,  Geon Yup LIM ,  Jin Ki SHIN ,  Dong Hoon KANG ,  Hyun Soo KIM ,  Kwang Soo KIM ,  Chang Suk OH ,  Young Jun LEE

IPC: G03F7/00 ,  H01L21/67 ,  H01L21/687

Abstract: Disclosed is a substrate processing apparatus in which weight of a buffer module may be reduced compared to the apparatus in the related art. The substrate processing apparatus may include: an index module; a buffer module; a treating module; and an interface module, in which the index module includes: a load port in which a container receiving a substrate is placed; and an index frame provided with an index robot for transferring the substrate between the container placed in the load port and the buffer module, the buffer module includes a buffer unit on which the substrate is placed, the treating module includes: a cooling chamber for cooling the substrate loaded from the buffer module; a liquid treating chamber for liquid treating the substrate loaded from the cooling chamber; a heat treating chamber for heat treating the substrate loaded from the cooling chamber; and a transfer chamber disposed between the liquid treating chamber and the heat treating chamber, and provided with a transfer robot for transferring the substrate to each of the liquid treating chamber, the heat treating chamber, and the cooling chamber, and when viewed from above, the cooling chamber and the buffer unit are provided in non-overlapping positions.

公开(公告)号：US20220206392A1

公开(公告)日：2022-06-30

申请号：US17566395

申请日：2021-12-30

Applicant: SEMES CO., LTD.

Inventor： Sang Eun NOH ,  Ki Sang EUM ,  Chang Suk OH

IPC: G03F7/16 ,  B05C5/02

Abstract: Provided is an apparatus for treating a substrate. In the exemplary embodiment, the apparatus for treating the substrate includes a cup configured to have a treating space with an opened upper portion; a support unit configured to support the substrate in the treating space; a liquid supply unit configured to have a treating liquid supply nozzle for supplying a treating liquid to the substrate supported by the support unit; and a nozzle standby port which is positioned outside treating space, provides a standby space in which the nozzle stands by before and after treating the substrate in the treating space, and has a cleaning member for cleaning the nozzle positioned in the standby space, wherein the nozzle standby port includes an insertion hole provided so that a nozzle tip of the treating liquid supply nozzle is insertable; and a spray member configured to spray a cleaning liquid to the nozzle tip inserted into the insertion hole, wherein an impact point of the cleaning liquid may be spaced apart from the center of the nozzle tip at a predetermined distance.