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公开(公告)号:US20180247835A1
公开(公告)日:2018-08-30
申请号:US15769367
申请日:2016-10-20
发明人: SOO YEON LEE , HO-YOUNG KIM , SEUNGHO KIM , JAE HONG LEE , JOONOH KIM , JINKYU KIM , BYUNG MAN KANG , IN IL JUNG
CPC分类号: H01L21/67028 , B08B5/02 , B08B2203/0229 , H01L21/02041 , H01L21/02046 , H01L21/02057 , H01L21/67017 , H01L21/67051 , H01L21/67173 , H01L21/68735 , H01L21/68785
摘要: The present invention provides a substrate treating apparatus. The substrate treating apparatus includes a chamber configured to provide a space for processing a substrate, a support unit provided in the chamber and configured to support the substrate, and a nozzle configured to supply a cleaning medium to the substrate supported by the support unit, the nozzle may include a contraction part which has an inlet, through which the cleaning medium is introduced, and a cross-sectional area of which decreases as it goes far from the inlet, an expansion part which has an ejection hole, through which the cleaning medium is ejected, and a cross-sectional area of which increases as it becomes closer to the ejection hole, and an orifice located between the contraction part and the expansion part, and the cleaning medium introduced into the contraction part is a single gas.