公开(公告)号：US11880642B2

公开(公告)日：2024-01-23

申请号：US17930091

申请日：2022-09-07

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： James Joseph Victory ,  Thomas Neyer ,  YunPeng Xiao ,  Hyeongwoo Jang ,  Peter Dingenen ,  Vaclav Valenta ,  Mehrdad Baghaie Yazdi ,  Christopher Lawrence Rexer ,  Stanley Benczkowski ,  Thierry Bordignon ,  Wai Lun Chu ,  Roman Sickaruk

IPC: G06F30/31 ,  G06F30/367 ,  G06F30/392 ,  G06F30/398 ,  G06N3/04 ,  G06N3/08 ,  G06F119/08 ,  G06F111/02 ,  G06F117/12

CPC classification number: G06F30/31 ,  G06F30/367 ,  G06F30/392 ,  G06F30/398 ,  G06N3/04 ,  G06N3/08 ,  G06F2111/02 ,  G06F2117/12 ,  G06F2119/08

Abstract: Implementations disclosed herein may include receiving from a user a selection of at least one die, a package type, and at least one test condition; generating, using a processor, a product die configuration and a product package configuration using a predictive modeling module and the at least one die and the package type; generating a graphic design system file; generating a package bonding diagram; generating a product spice model of the discrete device product using a technology computer aided design module; generating, using a processor, one or more datasheet characteristics of the discrete device product with the product SPICE model; generating a product datasheet for the discrete device product using the graphic design system file; and using a second interface generated by a computing device to provide access to the graphic design system file, the package bonding diagram, the product datasheet, and the product SPICE model.

公开(公告)号：US11481532B2

公开(公告)日：2022-10-25

申请号：US17076039

申请日：2020-10-21

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： James Joseph Victory ,  Thomas Neyer ,  YunPeng Xiao ,  Hyeongwoo Jang ,  Peter Dingenen ,  Vaclav Valenta ,  Tirthajyoti Sarkar ,  Mehrdad Baghaie Yazdi ,  Christopher Lawrence Rexer ,  Stanley Benczkowski ,  Thierry Bordignon ,  Wai Lun Chu ,  Roman Sickaruk

IPC: G06F30/367 ,  G06F30/31 ,  G06F30/392 ,  G06F30/398 ,  G06N3/04 ,  G06N3/08 ,  G06F119/08 ,  G06F111/02 ,  G06F117/12

Abstract: Implementations disclosed herein may include receiving from a user a selection of at least one die, a package type, and at least one test condition; generating, using a processor, a product die configuration and a product package configuration using a predictive modeling module and the at least one die and the package type; generating a graphic design system file; generating a package bonding diagram; generating a product spice model of the discrete device product using a technology computer aided design module; generating, using a processor, one or more datasheet characteristics of the discrete device product with the product SPICE model; generating a product datasheet for the discrete device product using the graphic design system file; and using a second interface generated by a computing device to provide access to the graphic design system file, the package bonding diagram, the product datasheet, and the product SPICE model.