公开(公告)号：US20230317579A1

公开(公告)日：2023-10-05

申请号：US18329203

申请日：2023-06-05

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Chee Hiong CHEW ,  Yushuang YAO ,  Atapol PRAJUCKAMOL ,  Chuncao NIU

IPC: H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H05K1/18 ,  H01L23/40

CPC classification number: H01L23/49811 ,  H01L23/40 ,  H01L23/49838 ,  H01L23/5385 ,  H01L23/562 ,  H05K1/184 ,  H01L2023/4087

Abstract: A semiconductor guide pin is disclosed. Specific implementations may include a heatsink, one or more substrates coupled together, one or more pressfit pins coupled to the one or more substrates, and two or more guide pins coupled to the one or more substrates, where the two or more guide pins may have a height greater than the one or more pressfit pins.

公开(公告)号：US20230027138A1

公开(公告)日：2023-01-26

申请号：US17807749

申请日：2022-06-20

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yushuang YAO ,  Chee Hiong CHEW ,  Vemmond Jeng Hung NG ,  Chuncao NIU ,  Sravan VANAPARTHY

IPC: H05K7/20 ,  H05K7/14

Abstract: A method includes attaching a power electronic substrate to a bottom of a frame. The frame has a box-like rectangular shape with an open top and an open bottom. The method further includes disposing an external conductive terminal on the frame. The external conductive terminal has at least one terminal stub that extends on to the front surface of the power electronic substrate. The method further includes welding the at least one terminal stub to at least one circuit trace disposed on the front surface of the power electronic substrate.

公开(公告)号：US20200373231A1

公开(公告)日：2020-11-26

申请号：US16502441

申请日：2019-07-03

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Chee Hiong CHEW ,  Yushuang YAO ,  Atapol PRAJUCKAMOL ,  Chuncao NIU

IPC: H01L23/498 ,  H05K1/18 ,  H01L23/40 ,  H01L23/538 ,  H01L23/00

Abstract: A semiconductor guide pin is disclosed. Specific implementations may include a heatsink, one or more substrates coupled together, one or more pressfit pins coupled to the one or more substrates, and two or more guide pins coupled to the one or more substrates, where the two or more guide pins may have a height greater than the one or more pressfit pins.