公开(公告)号：US20180342549A1

公开(公告)日：2018-11-29

申请号：US16054067

申请日：2018-08-03

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Bingzhi SU ,  Derek GOCHNOUR ,  Larry KINSMAN

IPC: H01L27/146 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/08 ,  H01L23/31 ,  H01L23/10

CPC classification number: H01L27/14618 ,  H01L21/4803 ,  H01L21/561 ,  H01L23/08 ,  H01L23/10 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/315 ,  H01L23/564 ,  H01L24/13 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/16588 ,  H01L2924/1715 ,  H01L2224/13099

Abstract: Implementations of semiconductor packages may include: a die coupled to a glass lid; one or more inner walls having a first material coupled to the die; an outer wall having a second material coupled to the die; and a glass lid coupled to the die at the one or more inner walls and at the outer wall; wherein the outer wall may be located at the edge of the die and the glass lid and the one or more inner walls may be located within the perimeter of the outer wall at a predetermined distance from the perimeter of the outer wall; and wherein a modulus of the first material may be lower than a modulus of the second material.

公开(公告)号：US20220415943A1

公开(公告)日：2022-12-29

申请号：US17930111

申请日：2022-09-07

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Oswald L. SKEETE ,  Brian Anthony VAARTSTRA ,  Derek GOCHNOUR

IPC: H01L27/146 ,  H01L21/768 ,  H01L21/56 ,  H01L23/48 ,  H01L23/00

Abstract: Implementations of image sensor packages may include a plurality of microlenses coupled over a color filter array (CFA), a low refractive index layer directly coupled to and over the plurality of microlenses, an adhesive directly coupled to and over the low refractive index layer, and an optically transmissive cover directly coupled to and over the adhesive. Implementations may include no gap present between the optically transmissive cover and the plurality of microlenses.

公开(公告)号：US20180019275A1

公开(公告)日：2018-01-18

申请号：US15674738

申请日：2017-08-11

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Bingzhi SU ,  Derek GOCHNOUR ,  Larry KINSMAN

IPC: H01L27/146 ,  H01L23/31 ,  H01L21/56 ,  H01L23/10 ,  H01L23/08 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L27/14618 ,  H01L21/4803 ,  H01L21/561 ,  H01L23/08 ,  H01L23/10 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/315 ,  H01L23/564 ,  H01L24/13 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/16588 ,  H01L2924/1715 ,  H01L2224/13099

Abstract: Implementations of semiconductor packages may include: a die coupled to a glass lid; one or more inner walls having a first material coupled to the die; an outer wall having a second material coupled to the die; and a glass lid coupled to the die at the one or more inner walls and at the outer wall; wherein the outer wall may be located at the edge of the die and the glass lid and the one or more inner walls may be located within the perimeter of the outer wall at a predetermined distance from the perimeter of the outer wall; and wherein a modulus of the first material may be lower than a modulus of the second material.