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公开(公告)号:US20210026164A1
公开(公告)日:2021-01-28
申请号:US16715090
申请日:2019-12-16
Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Inventor: Orit SKORKA , Brian Anthony VAARTSTRA , Radu ISPASOIU
IPC: G02F1/01 , G02F1/137 , G02F1/1343 , G02F1/1335 , G02F1/1339 , G02B3/00 , H04N5/225
Abstract: Imaging systems may include tunable polarization filters. A tunable polarization filter may be integrated directly into an image sensor package. For example, the tunable polarization filter may serve as cover glass for the image sensor package. Tunable polarization package glass may be incorporated into image sensor packages that have air gaps between the image sensor and the cover glass or that have transparent adhesive between the image sensor and the cover glass. The tunable polarization layer may be controlled at a global level, at a sub-array level, or at a pixel level. In some cases, the tunable polarization layer may be a tunable polarization filter. In this example, the direction of the polarization filter is tuned. In other cases, the tunable polarization layer may be a tunable polarization rotator. In this example, the tunable polarization layer selectively rotates the polarization of light that passes through the tunable polarization layer.
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公开(公告)号:US20220232156A1
公开(公告)日:2022-07-21
申请号:US17643714
申请日:2021-12-10
Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Inventor: Orit SKORKA , Radu ISPASOIU , Brian Anthony VAARTSTRA
IPC: H04N5/235 , G02F1/1335
Abstract: An imaging system may include an electronic shutter. The electronic shutter may be positioned between an image sensor and a lens module or may be integrated as a package cover for the image sensor. The electronic shutter may selectively attenuate incident light that passes to the image sensor. To increase the dynamic range of the imaging system, the electronic shutter may have a first transparency while a first image is captured by the image sensor and a second, different transparency while a second image is captured by the image sensor. The first and second images are subsequently combined to form a single high dynamic range image. The electronic shutter may be controlled at a global level, at a sub-array level, or at a pixel level.
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公开(公告)号:US20240167873A1
公开(公告)日:2024-05-23
申请号:US18056524
申请日:2022-11-17
Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Inventor: Brian Anthony VAARTSTRA , Larry Duane KINSMAN
CPC classification number: G01J3/2803 , G01D5/24
Abstract: A package includes an optical sensor die, a support grid structure disposed on the optical sensor die, and an optically transparent cover attached to the support grid structure. A surface of the optical sensor die includes an optically active surface area (OASA) and an edge surface portion lying outside a perimeter of the OASA. The support grid structure disposed on the surface of the optical sensor die includes at least one pillar disposed within the OASA and an edge block disposed on the edge surface portion lying outside the perimeter of the OASA. The optically transparent cover is supported by the support grid structure at a height above the optical sensor die while maintaining an air gap between the optically transparent cover and the OASA.
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公开(公告)号:US20170374306A1
公开(公告)日:2017-12-28
申请号:US15191319
申请日:2016-06-23
Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Inventor: Brian Anthony VAARTSTRA , Nathan Wayne CHAPMAN
CPC classification number: H04N5/3696 , H01L27/14621 , H01L27/14627 , H01L27/14645 , H04N5/2258 , H04N5/23212 , H04N9/045
Abstract: An imaging system may include at least two image sensors. Each image sensor may have a respective lens module that is configured to focus light on the image sensor. One of the image sensors may be a monochrome sensor, while another image sensor may be a color sensor. The monochrome sensor may include phase detection pixels while the color sensor may not include phase detection pixels. The imaging system may include processing circuitry that is configured to adjust the lens modules for both the monochrome and color sensors based on the data from the phase detection pixels.
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公开(公告)号:US20220415943A1
公开(公告)日:2022-12-29
申请号:US17930111
申请日:2022-09-07
Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Inventor: Oswald L. SKEETE , Brian Anthony VAARTSTRA , Derek GOCHNOUR
IPC: H01L27/146 , H01L21/768 , H01L21/56 , H01L23/48 , H01L23/00
Abstract: Implementations of image sensor packages may include a plurality of microlenses coupled over a color filter array (CFA), a low refractive index layer directly coupled to and over the plurality of microlenses, an adhesive directly coupled to and over the low refractive index layer, and an optically transmissive cover directly coupled to and over the adhesive. Implementations may include no gap present between the optically transmissive cover and the plurality of microlenses.
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公开(公告)号:US20220013563A1
公开(公告)日:2022-01-13
申请号:US16948799
申请日:2020-10-01
Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Inventor: Nathan Wayne CHAPMAN , Brian Anthony VAARTSTRA , Amanda Thuy Trang VU
IPC: H01L27/146
Abstract: An image sensor with uniform, well-controlled air gaps is provided. A structure that is at least partially filled with organic material may be formed on the image sensor. A hybrid organic/inorganic film layer may be formed over the organic material. The image sensor may then be exposed to energy, which causes the organic material to sublimate through the hybrid film layer, which itself may become a gas permeable layer when exposed to energy. After sublimation, the regions where the organic material was previously filled become air gaps with a low index of refraction. Air gaps formed in this way can be configured over photodiodes as light guides or focusing structures, as concave/convex microlenses, in between photodiodes as isolation structures, in between color filter elements to reduce crosstalk, and/or over microlenses to enhancing focusing power.
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公开(公告)号:US20200183057A1
公开(公告)日:2020-06-11
申请号:US16214972
申请日:2018-12-10
Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Inventor: Ulrich BOETTIGER , Brian Anthony VAARTSTRA
Abstract: Three-dimensional structures may be formed on a substrate using a propellant that may decompose to form a gaseous byproduct. At least one overlying shell layer may deform due to volumes of gas between the substrate and the shell layer formed by the gaseous byproduct, thereby forming the three-dimensional structures. Multiple layers of propellant and shell layers may be stacked to multi-layered, three-dimensional structures. Propellant with different concentrations and shell layers with different thicknesses and materials may be used to control the shapes formed when the propellant is decomposed. Alternatively, porous layers may be deposited on a substrate and heated to expand volumes of gas between the substrate and the porous layers, thereby forming three-dimensional structures. The three-dimensional structures may be formed as microlenses in imaging sensor pixels, as it may be desired to form an array of microlenses that vary in size, shape, or curvature across one or more pixels.
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公开(公告)号:US20200052024A1
公开(公告)日:2020-02-13
申请号:US16455046
申请日:2019-06-27
Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Inventor: Richard MAURITZSON , Bartosz Piotr BANACHOWICZ , Jon DALEY , Brian Anthony VAARTSTRA
IPC: H01L27/146 , H01L27/148
Abstract: Implementations of image sensors may include a passivation layer coupled over a silicon layer, a color-filter-array coupled over the passivation layer, a lens coupled over the color-filter-array, and at least two optically transmissive charge dissipation layers coupled over the silicon layer.
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公开(公告)号:US20190123083A1
公开(公告)日:2019-04-25
申请号:US15787959
申请日:2017-10-19
Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Inventor: Swarnal BORTHAKUR , Nathan Wayne CHAPMAN , Brian Anthony VAARTSTRA
IPC: H01L27/146
Abstract: An image sensor may include an array of pixels having a color filter layer. The color filter layer may include colored elements and clear elements. The clear elements may be formed from transparent dielectric material. The color filter layer may include a grid of light-blocking material that forms color filter container structures having an array of openings in which the colored elements and the clear elements are formed. The color filter container structures may be formed from the same transparent dielectric material that forms the clear elements. The color filter container structures may be formed from opaque materials or transparent materials that form structures such as planarization layers, microlenses, or antireflection coatings for the array of pixels. The material used to form the color filter container structures may have a refractive index that is sufficiently high to prevent light from passing between adjacent elements in the color filter layer.
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公开(公告)号:US20180301484A1
公开(公告)日:2018-10-18
申请号:US15488646
申请日:2017-04-17
Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Inventor: Brian Anthony VAARTSTRA , Nathan Wayne CHAPMAN
IPC: H01L27/146 , H04N5/369
Abstract: An image sensor may include phase detecting and autofocusing (PDAF) pixels. Each PDAF pixel may be hexagonal may be divided into two or more photodiode regions. A semi-spherical microlens may be formed over each PDAF pixel. Each PDAF pixel may be further divided into an inner sub-pixel portion and an outer sub-pixel portion to provide high dynamic range (HDR) functionality. The outer sub-pixel portion may be further divided into two or more photodiode regions to provide depth sensing capability. A semi-toroidal microlens may be formed over each PDAF HDR pixel. Each PDAF HDR pixel may also have a snowflake-like shape or some irregular shape. Smaller interstitial pixels may be dispersed among the larger snowflake-like pixels.
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