公开(公告)号：US20210272920A1

公开(公告)日：2021-09-02

申请号：US17320495

申请日：2021-05-14

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Michael J. SEDDON ,  Takashi NOMA ,  Kazuo OKADA ,  Hideaki YOSHIMI ,  Naoyuki YOMODA ,  Yusheng LIN

IPC: H01L23/00 ,  H01L21/78 ,  H01L23/498

Abstract: Implementations of semiconductor devices may include a die having a first side and a second side, a contact pad coupled to the first side of the die, and a metal layer coupled to the second side of the die. A thickness of the die may be no more than four times a thickness of the metal layer.

公开(公告)号：US20190267344A1

公开(公告)日：2019-08-29

申请号：US15903677

申请日：2018-02-23

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Michael J. SEDDON ,  Takashi NOMA ,  Kazuo OKADA ,  Hideaki YOSHIMI ,  Naoyuki YOMODA ,  Yusheng LIN

IPC: H01L23/00 ,  H01L23/498 ,  H01L21/78

Abstract: Implementations of semiconductor devices may include a die having a first side and a second side, a contact pad coupled to the first side of the die, and a metal layer coupled to the second side of the die. A thickness of the die may be no more than four times a thickness of the metal layer.