公开(公告)号：US20190229144A1

公开(公告)日：2019-07-25

申请号：US16374720

申请日：2019-04-03

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Larry KINSMAN ,  Yusheng LIN ,  Yu-Te HSIEH ,  Oswald SKEETE ,  Weng-Jin WU ,  Chi-Yao KUO

IPC: H01L27/146 ,  H01L21/56 ,  H01L23/498 ,  H04N5/374 ,  H01L21/48

Abstract: An image sensor semiconductor package (package) includes a printed circuit board (PCB) having a first surface and a second surface opposite the first surface. A complementary metal-oxide semiconductor (CMOS) image sensor (CIS) die has a first surface with a photosensitive region and a second surface opposite the first surface of the CIS die. The second surface of the CIS die is coupled with the first surface of the PCB. A transparent cover is coupled over the photosensitive region of the CIS die. An image signal processor (ISP) is embedded within the PCB. One or more electrical couplers electrically couple the CIS die with the PCB. A plurality of electrical contacts on the second surface of the PCB are electrically coupled with the CIS die and with the ISP. The ISP is located between the plurality of electrical contacts of the second surface of the PCB and the CIS die.

公开(公告)号：US20170345864A1

公开(公告)日：2017-11-30

申请号：US15168828

申请日：2016-05-31

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Larry KINSMAN ,  Yusheng LIN ,  Yu-Te HSIEH ,  Oswald SKEETE ,  Weng-Jin WU ,  Chi-Yao KUO

IPC: H01L27/146 ,  H01L21/56 ,  H01L23/498 ,  H04N5/374 ,  H01L21/48

CPC classification number: H01L27/14643 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/49816 ,  H01L23/49838 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1469 ,  H01L2224/24 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/181 ,  H04N5/374 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An image sensor semiconductor package (package) includes a printed circuit board (PCB) having a first surface and a second surface opposite the first surface. A complementary metal-oxide semiconductor (CMOS) image sensor (CIS) die has a first surface with a photosensitive region and a second surface opposite the first surface of the CIS die. The second surface of the CIS die is coupled with the first surface of the PCB. A transparent cover is coupled over the photosensitive region of the CIS die. An image signal processor (ISP) is embedded within the PCB. One or more electrical couplers electrically couple the CIS die with the PCB. A plurality of electrical contacts on the second surface of the PCB are electrically coupled with the CIS die and with the ISP. The ISP is located between the plurality of electrical contacts of the second surface of the PCB and the CIS die.