公开(公告)号：US20180219038A1

公开(公告)日：2018-08-02

申请号：US15421505

申请日：2017-02-01

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jeffrey Peter GAMBINO ,  Kyle THOMAS ,  David T. PRICE ,  Rusty WINZENREAD ,  Bruce GREENWOOD

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14634 ,  H01L27/14636

Abstract: Implementations of semiconductor packages may include: a digital signal processor having a first side and a second side and an image sensor array, having a first side and a second side. The first side of the image sensor array may be coupled to the second side of the digital signal processor through a plurality of hybrid bond interconnect (HBI) bond pads and an edge seal. One or more openings may extend from the second side of the image sensor array into the second side of the digital signal processor to an etch stop layer in the second side of the digital signal processor. The one or more openings may form a second edge seal between the plurality of HBI bond pads and the edge of the digital signal processor.

公开(公告)号：US20240194710A1

公开(公告)日：2024-06-13

申请号：US18586731

申请日：2024-02-26

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jeffrey Peter GAMBINO ,  Kyle THOMAS ,  David T. PRICE ,  Rusty WINZENREAD ,  Bruce GREENWOOD

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14634 ,  H01L27/14636

Abstract: Implementations of semiconductor packages may include: a digital signal processor having a first side and a second side and an image sensor array, having a first side and a second side. The first side of the image sensor array may be coupled to the second side of the digital signal processor through a plurality of hybrid bond interconnect (HBI) bond pads and an edge seal. One or more openings may extend from the second side of the image sensor array into the second side of the digital signal processor to an etch stop layer in the second side of the digital signal processor. The one or more openings may form a second edge seal between the plurality of HBI bond pads and the edge of the digital signal processor.

公开(公告)号：US20200106971A1

公开(公告)日：2020-04-02

申请号：US16225704

申请日：2018-12-19

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Rusty WINZENREAD

IPC: H04N5/347 ,  H04N5/378

Abstract: An image sensor may include an array of imaging pixels. Each imaging pixel may have a photodiode that generates charge in response to incident light, a floating diffusion region, and a transfer transistor that transfers charge from the photodiode to the floating diffusion region. Each floating diffusion region may have an associated capacitance formed by a depletion region between n-type and p-type regions in a semiconductor substrate. To enable selective binning in the voltage domain, a number of transistors may be coupled to the floating diffusion capacitors. A first plurality of pixels may selectively couple the floating diffusion capacitors to ground. A second plurality of pixels may selective couple the floating diffusion capacitors to the floating diffusion capacitors of adjacent pixels. The voltages of multiple floating diffusion capacitors may be non-destructively binned on a single floating diffusion capacitor during readout.

公开(公告)号：US20250151431A1

公开(公告)日：2025-05-08

申请号：US19013861

申请日：2025-01-08

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jeffrey Peter GAMBINO ,  Kyle THOMAS ,  David T. PRICE ,  Rusty WINZENREAD ,  Bruce Blair GREENWOOD

IPC: H10F39/00

Abstract: Implementations of semiconductor packages may include: a digital signal processor having a first side and a second side and an image sensor array, having a first side and a second side. The first side of the image sensor array may be coupled to the second side of the digital signal processor through a plurality of hybrid bond interconnect (HBI) bond pads and an edge seal. One or more openings may extend from the second side of the image sensor array into the second side of the digital signal processor to an etch stop layer in the second side of the digital signal processor. The one or more openings may form a second edge seal between the plurality of HBI bond pads and the edge of the digital signal processor.

公开(公告)号：US20230261015A1

公开(公告)日：2023-08-17

申请号：US18305959

申请日：2023-04-24

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jeffrey Peter GAMBINO ,  Kyle THOMAS ,  David T. PRICE ,  Rusty WINZENREAD ,  Bruce GREENWOOD

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14636 ,  H01L27/14634

Abstract: Implementations of semiconductor packages may include: a digital signal processor having a first side and a second side and an image sensor array, having a first side and a second side. The first side of the image sensor array may be coupled to the second side of the digital signal processor through a plurality of hybrid bond interconnect (HBI) bond pads and an edge seal. One or more openings may extend from the second side of the image sensor array into the second side of the digital signal processor to an etch stop layer in the second side of the digital signal processor. The one or more openings may form a second edge seal between the plurality of HBI bond pads and the edge of the digital signal processor.