公开(公告)号：US20220020740A1

公开(公告)日：2022-01-20

申请号：US16948796

申请日：2020-10-01

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Tiburcio A. MALDO ,  Keunhyuk LEE ,  Jerome TEYSSEYRE

IPC: H01L27/06 ,  H01L23/498 ,  H01L23/13 ,  H01L21/48

Abstract: Described implementations provide wireless, surface mounting of at least two semiconductor devices on opposed surfaces of a leadframe, to provide an isolated, three-dimensional (3D) configuration. The described implementations minimize electrical failures, even for very high voltage applications, while enabling low inductance and high current. Resulting semiconductor device packages have mounting surfaces that provide desired levels of isolation and insulation, while still enabling straightforward mounting techniques, such as soldering, as well as high levels of thermal reliability.

公开(公告)号：US20230326902A1

公开(公告)日：2023-10-12

申请号：US17658885

申请日：2022-04-12

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Keunhyuk LEE ,  Jerome TEYSSEYRE ,  Tiburcio A. MALDO

IPC: H01L23/00

CPC classification number: H01L24/72 ,  H01L24/90

Abstract: A clip preform includes a die contact portion and an aligner structure. An intermediate portion connects the die contact portion to a lead contact portion in the aligner structure. The die contact portion is configured to contact a semiconductor die. The aligner structure is configured to attach the lead contact portion to a lead post. The die contact portion, the intermediate portion, and the aligner structure form a structure of a primary clip for connecting the semiconductor die to the lead post. The clip preform is severable by removing parts of the die contact portion and the intermediate portion of the clip preform to form a secondary clip for connecting the semiconductor die to the lead post. The aligner structure, a remaining part of the die contact portion, and a remaining part of the intermediate portion of the clip preform form a structure of the secondary clip.

公开(公告)号：US20240413148A1

公开(公告)日：2024-12-12

申请号：US18808298

申请日：2024-08-19

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Tiburcio A. MALDO ,  Keunhyuk LEE ,  Jerome TEYSSEYRE

IPC: H01L27/06 ,  H01L21/48 ,  H01L23/13 ,  H01L23/498

Abstract: Described implementations provide wireless, surface mounting of at least two semiconductor devices on opposed surfaces of a leadframe, to provide an isolated, three-dimensional (3D) configuration. The described implementations minimize electrical failures, even for very high voltage applications, while enabling low inductance and high current. Resulting semiconductor device packages have mounting surfaces that provide desired levels of isolation and insulation, while still enabling straightforward mounting techniques, such as soldering, as well as high levels of thermal reliability.

公开(公告)号：US20240194631A1

公开(公告)日：2024-06-13

申请号：US18444180

申请日：2024-02-16

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Keunhyuk LEE ,  Jerome TEYSSEYRE ,  Tiburcio A. MALDO

IPC: H01L23/00

CPC classification number: H01L24/72 ,  H01L24/90

Abstract: A clip preform includes a die contact portion and an aligner structure. An intermediate portion connects the die contact portion to a lead contact portion in the aligner structure. The die contact portion is configured to contact a semiconductor die. The aligner structure is configured to attach the lead contact portion to a lead post. The die contact portion, the intermediate portion, and the aligner structure form a structure of a primary clip for connecting the semiconductor die to the lead post. The clip preform is severable by removing parts of the die contact portion and the intermediate portion of the clip preform to form a secondary clip for connecting the semiconductor die to the lead post. The aligner structure, a remaining part of the die contact portion, and a remaining part of the intermediate portion of the clip preform form a structure of the secondary clip.