公开(公告)号：US20210367124A1

公开(公告)日：2021-11-25

申请号：US17322129

申请日：2021-05-17

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Namgoo CHA ,  Sang Min KIM ,  Seongchan PARK ,  Yeonkyu PARK ,  Jae Hee LIM ,  Jinkyu JANG

IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L33/22 ,  H01L33/58 ,  H01L33/54 ,  H01L33/46

Abstract: A unit pixel includes a transparent substrate, a plurality of light emitting devices arranged on the transparent substrate, connection layers electrically connected to the light emitting devices, and bonding pads disposed over the connection layers and electrically connected to the connection layers. The bonding pads are partially overlapped with at least one of the light emitting devices in a vertical direction, respectively.

公开(公告)号：US20240243242A1

公开(公告)日：2024-07-18

申请号：US18623750

申请日：2024-04-01

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Namgoo CHA ,  Sang Min KIM ,  Seongchan PARK ,  Yeonkyu PARK ,  Jae Hee LIM ,  Jinkyu JANG

IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L33/22 ,  H01L33/46 ,  H01L33/54 ,  H01L33/58

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/22 ,  H01L33/46 ,  H01L33/54 ,  H01L33/58

Abstract: A unit pixel includes a transparent substrate, a plurality of light emitting devices arranged on the transparent substrate, connection layers electrically connected to the light emitting devices, and bonding pads disposed over the connection layers and electrically connected to the connection layers. The bonding pads are partially overlapped with at least one of the light emitting devices in a vertical direction, respectively.