公开(公告)号：US10593850B2

公开(公告)日：2020-03-17

申请号：US15868976

申请日：2018-01-11

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon Chae ,  Yeon Cheol Cho ,  Cun Bok Jeong ,  Hyoung Jin Lim

IPC: H01L33/62 ,  H01L33/36 ,  H01L33/38

Abstract: A method for manufacturing a light emitting diode package comprises: arranging a first solder and a second solder between a substrate and a light emitting diode; and subjecting the first solder and the second solder to heat treatment to bond the substrate and the light emitting diode. The heat treatment comprises: increasing the temperature of the first and second solders from room temperature to a temperature Tp; maintaining the temperature Tp; and lowering the temperature Tp. The heating step comprises: a first ramping step of increasing a temperature from room temperature to a temperature TA at a constant speed; a pre-heating step of increasing the temperature from the temperature TA to a temperature TB to impart fluidity to the first and second solders; and a second ramping step of increasing the temperature from the TB to TL at a constant speed.

公开(公告)号：US20180138382A1

公开(公告)日：2018-05-17

申请号：US15868976

申请日：2018-01-11

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon Chae ,  Yeon Cheol Cho ,  Cun Bok Jeong ,  Hyoung Jin Lim

IPC: H01L33/62 ,  H01L33/36

CPC classification number: H01L33/62 ,  H01L33/36 ,  H01L33/382 ,  H01L33/387 ,  H01L2224/16225 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: A method for manufacturing a light emitting diode package comprises: arranging a first solder and a second solder between a substrate and a light emitting diode; and subjecting the first solder and the second solder to heat treatment to bond the substrate and the light emitting diode. The heat treatment comprises: increasing the temperature of the first and second solders from room temperature to a temperature Tp; maintaining the temperature Tp; and lowering the temperature Tp. The heating step comprises: a first ramping step of increasing a temperature from room temperature to a temperature TA at a constant speed; a pre-heating step of increasing the temperature from the temperature TA to a temperature TB to impart fluidity to the first and second solders; and a second ramping step of increasing the temperature from the TB to TL at a constant speed.