公开(公告)号：US20150357308A1

公开(公告)日：2015-12-10

申请号：US14235808

申请日：2013-11-27

Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Minghu QI ,  Chun Hao WU ,  Kun Hsien Lin ,  Yongqiang Wang ,  Zhiyou SHU ,  Weibing YANG ,  Zenghong CHEN ,  Guokun Yang ,  Chenyangzl LI ,  Yunshao Jiang

IPC: H01L25/065 ,  H01L23/538 ,  G02F1/133

CPC classification number: H01L25/0655 ,  G02F1/1303 ,  G02F1/13306 ,  G02F1/13454 ,  H01L23/4985 ,  H01L23/5387 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/75301 ,  H01L2224/7598 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/97 ,  Y10T156/1052 ,  H01L2224/83 ,  H01L2924/00014

Abstract: The present invention provides a chip-on-film (COF) tape and a corresponding COF bonding method. The COF tape comprises a base tape, a plurality of first COFs and second COFs, the first and second COFs are arranged on the base tape in an alternating manner, and are correspondingly punched onto a moving platform by a punching mechanism, and are respectively bonded onto two side edges of a liquid crystal panel. The present invention can simultaneously process the bonding operations of the two types of COF by using only one COF tape and one set of equipment, thus lowering the cost and increasing the productivity.

Abstract translation: 本发明提供一种片上胶片（COF）胶带和相应的COF粘合方法。 COF带包括基带，多个第一COF和第二COF，第一COF和第二COF以交替的方式布置在基带上，并且通过冲压机构相应地冲压到移动平台上，并分别粘合 在液晶面板的两个侧边缘上。 本发明可以通过仅使用一个COF带和一组设备同时处理两种COF的接合操作，从而降低成本并提高生产率。