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    Vibration sensors
    1.
    发明授权
    Vibration sensors 有权

    公开(公告)号：US11662248B2

    公开(公告)日：2023-05-30

    申请号：US17814533

    申请日：2022-07-25

    Applicant: SHENZHEN SHOKZ CO., LTD.

    Inventor： Yongshuai Yuan ,  Wenjun Deng ,  Wenbing Zhou ,  Yujia Huang ,  Fengyun Liao ,  Xin Qi

    IPC: G01H11/06 ,  H04R7/04 ,  H04R7/08 ,  G01H11/08 ,  H04R1/08

    CPC classification number: G01H11/06 ,  G01H11/08 ,  H04R1/08 ,  H04R7/04 ,  H04R7/08

    Abstract: The embodiments of the present disclosure may disclose a vibration sensor, including: an acoustic transducer and a vibration assembly connected with the acoustic transducer. The vibration assembly may be configured to transmit an external vibration signal to the acoustic transducer to generate an electric signal, the vibration assembly includes one or more groups of vibration diaphragms and mass blocks, and the mass blocks may be physically connected with the vibration diaphragms. The vibration assembly may be configured to make a sensitivity degree of the vibration sensor greater than a sensitivity degree of the acoustic transducer in one or more target frequency bands.

    Sensing devices
    2.
    发明授权
    Sensing devices 有权

    公开(公告)号：US11698292B2

    公开(公告)日：2023-07-11

    申请号：US17812179

    申请日：2022-07-13

    Applicant: SHENZHEN SHOKZ CO., LTD.

    Inventor： Wenjun Deng ,  Yongshuai Yuan ,  Wenbing Zhou ,  Yujia Huang

    IPC: G01H11/06 ,  H04R9/08

    CPC classification number: G01H11/06 ,  H04R9/08

    Abstract: The embodiment of the present disclosure discloses a sensing device, comprising: an elastic component; a sensing cavity, wherein the elastic component forms a first sidewall of the sensing cavity; and an energy conversion component configured to obtain a sensing signal and convert the sensing signal into an electrical signal, the energy conversion component being in communication with the sensing cavity, and the sensing signal relating to a change of a volume of the sensing cavity, wherein at least one convex structure is arranged on one side of the elastic component facing toward the sensing cavity, the elastic component drives the at least one convex structure to move in response to an external signal, and the movement of the at least one convex structure changing the volume of the sensing cavity.

    Microphones
    4.
    发明授权
    Microphones 有权

    公开(公告)号：US12207041B2

    公开(公告)日：2025-01-21

    申请号：US17816007

    申请日：2022-07-29

    Applicant: SHENZHEN SHOKZ CO., LTD.

    Inventor： Wenbing Zhou ,  Yujia Huang ,  Yongshuai Yuan ,  Wenjun Deng ,  Xin Qi ,  Fengyun Liao

    IPC: H04R1/22

    Abstract: The present disclosure provides a microphone including at least one acoustoelectric transducer and an acoustic structure. The acoustoelectric transducer is configured to convert a sound signal to an electrical signal. The acoustic structure includes a sound guiding tube and an acoustic cavity. The acoustic cavity is in acoustic communication with the acoustoelectric transducer, and is in acoustic communication with outside of the microphone through the sound guiding tube. The acoustic structure has a first resonance frequency, the acoustoelectric transducer has a second resonance frequency, and an absolute value of a difference between the first resonance frequency and the second resonance frequency is not less than 100 Hz. By disposing different acoustic structures, resonance peaks in different frequency ranges may be added to the microphone, which improves a sensitivity of the microphone near multiple resonance peaks, thereby improving a sensitivity of the microphone in the entire wide frequency band.

    Microphone with low noise and high Q value
    5.
    发明授权
    Microphone with low noise and high Q value 有权

    公开(公告)号：US12185045B2

    公开(公告)日：2024-12-31

    申请号：US17816019

    申请日：2022-07-29

    Applicant: SHENZHEN SHOKZ CO., LTD.

    Inventor： Wenbing Zhou ,  Yujia Huang ,  Yongshuai Yuan ,  Wenjun Deng ,  Xin Qi ,  Fengyun Liao

    IPC: H04R1/08 ,  H04R1/04 ,  H04R1/28 ,  H04R17/02

    Abstract: The present disclosure may provide a microphone. The microphone may include: a shell structure and a vibration pickup portion, wherein the vibration pickup portion may generate vibration in response to vibration of the shell structure; the vibration transmission portion may be configured to transmit the vibration generated by the vibration pickup portion; and an acoustic-electric conversion component configured to receive the vibration transmitted by the vibration transmission portion to generate an electrical signal, wherein the vibration transmission portion and at least a portion of vibration pickup portion may form a vacuum cavity, and the acoustic-electric conversion component may be located in the vacuum cavity.

    Systems and methods for terminal control
    9.
    发明授权
    Systems and methods for terminal control 有权

    公开(公告)号：US12217591B2

    公开(公告)日：2025-02-04

    申请号：US17814222

    申请日：2022-07-21

    Applicant: SHENZHEN SHOKZ CO., LTD.

    Inventor： Yongshuai Yuan ,  Wenjun Deng ,  Wenbing Zhou ,  Yujia Huang ,  Fengyun Liao ,  Xin Qi

    IPC: G08B21/04 ,  A61B5/00 ,  G01H1/12 ,  G06F3/01

    Abstract: The embodiments of the present disclosure disclose a system and method. The system may include at least one storage device configured to storage computer instruction; and at least one processor, in communication with the storage device. When executing the computer instructions, the at least one processor is configured to direct the system to perform operations including: obtaining a sensing signal of at least one sensing device; identifying a signal feature of the sensing signal; and determining, based on the signal feature, an operation of a target object associated with the at least one sensing device.

    Bone conduction microphone
    10.
    发明授权
    Bone conduction microphone 有权

    公开(公告)号：US12114129B2

    公开(公告)日：2024-10-08

    申请号：US17664875

    申请日：2022-05-25

    Applicant: SHENZHEN SHOKZ CO., LTD.

    Inventor： Wenbing Zhou ,  Yongshuai Yuan ,  Wenjun Deng ,  Xin Qi ,  Fengyun Liao

    IPC: H04R1/46 ,  H04R1/08 ,  H04R1/28

    CPC classification number: H04R1/46 ,  H04R1/083 ,  H04R1/2876 ,  H04R2460/13

    Abstract: A bone conduction microphone is provided. The bone conduction microphone may include a laminated structure formed by a vibration unit and an acoustic transducer unit. The bone conduction microphone may include a base structure configured to carry the laminated structure. At least one side of the laminated structure may be physically connected to the base structure. The base structure may vibrate based on an external vibration signal. The vibration unit may be deformed in response to the vibration of the base structure. The acoustic transducer unit may generate an electrical signal based on the deformation of the vibration unit. The bone conduction microphone may include at least one damping structural layer. The at least one damping structural layer may be arranged on an upper surface, a lower surface, and/or an interior of the laminated structure, and the at least one damping layer may be connected to the base structure.

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