Abstract:
A method for forming a thin film having durability at a low cost is provided. A film formation apparatus 1 is used in the film formation method. The apparatus 1 comprises a vacuum container 11 in which a substrate 100 is placed at a lower part, a vacuum pump 15 for exhaust inside the container 11, a storage container 23 for storing a coating agent 21 provided outside the container 11, and a nozzle having an ejection part 19 capable of ejecting the coating agent 21 at its one end. A solution including two or more kinds of materials is used as the coating agent 21. The solution is ejected to the substrate in an atmosphere at a pressure set based on vapor pressures of respective materials composing the solution.
Abstract:
A method for forming a thin film having durability at a low cost is provided. A film formation apparatus 1 is used in the film formation method. The apparatus 1 comprises a vacuum container 11 in which a substrate 100 is placed at a lower part, a vacuum pump 15 for exhaust inside the container 11, a storage container 23 for storing a coating agent 21 provided outside the container 11, and a nozzle having an ejection part 19 capable of ejecting the coating agent 21 at its one end. A solution including two or more kinds of materials including a first material (S1) and a second material (S2) having a higher vapor pressure (P2) than a vapor pressure (P1) of the Si is used as the coating agent 21. The coating agent 21 is ejected to the substrate in an atmosphere with a pressure higher than P1 and lower than P2.
Abstract:
A method for forming a thin film having durability at a low cost is provided. A film formation apparatus 1 is used in the film formation method. The apparatus 1 comprises a vacuum container 11 in which a substrate 100 is placed at a lower part, a vacuum pump 15 for exhaust inside the container 11, a storage container 23 for storing a coating agent 21 provided outside the container 11, and a nozzle having an ejection part 19 capable of ejecting the coating agent 21 at its one end. A solution including two or more kinds of materials is used as the coating agent 21. The solution is ejected to the substrate in an atmosphere at a pressure set based on vapor pressures of respective materials composing the solution.
Abstract:
A method for forming a thin film having durability at a low cost is provided. A film formation apparatus 1 is used in the film formation method. The apparatus 1 comprises a vacuum container 11, in which a substrate 100 is placed at a lower part, a vacuum pump 15 for exhaust inside the container 11, a storage container 23 for storing a coating agent 21 provided outside the container 11, a nozzle having an ejection part 19 capable of ejecting the coating agent 21 at its one end and a pressurizing means (a gas supply source 29, etc.) for pressurizing a liquid surface of a coating agent 21 stored in the storage container 23. A solution, which includes two or more kinds of materials including a first material (S1) and a second material (S2) having a higher vapor pressure (P2) than a vapor pressure (P1) of the S1 and has a concentration of the first material being 0.01 wt % or more, is used as the coating agent 21. The coating agent 21 is ejected to a substrate in an atmosphere with a pressure of P2 or higher (excepting pressures higher than P2 by one digit or more) and with an ejection pressure of 0.05 to 0.3 MPa.
Abstract:
Provided is a film formation apparatus with which an anti-fouling film having high usability and antiwear performance may be formed efficiently. According to a film formation apparatus (1) of the present invention, a substrate holder (12) which comprises a basal body holding surface for folding a plurality of substrates (14) is disposed in a vacuum container (10) in a rotatable manner. The film formation apparatus (1) comprises an evaporation source (34) which is disposed in the vacuum container (10) in such a manner that a larger amount of film formation material may be supplied to a first area (A3) that is part of the basal body holding surface than to an area other than the first area (remaining area) when operated toward the substrate holder (12) in a rotation stop state; and an ion source (38) which is disposed in the vacuum container (10) in such a manner, arrangement, and/or direction that energetic particle irradiation may be made toward only a second area (A2) that is part of the basal body holding surface when operated toward the substrate holder (12) in the rotation stop state.