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公开(公告)号:US20170349743A1
公开(公告)日:2017-12-07
申请号:US15533549
申请日:2015-12-11
Applicant: SHOWA DENKO K.K.
Inventor: Hiromi OTAKE , Aoi NAKANO , Chika YAMASHITA , Yoshitaka ISHIBASHI , Hiroshi UCHIDA
IPC: C08L61/16 , C08K5/14 , C08F290/14
CPC classification number: C08L61/16 , C08F290/14 , C08K3/00 , C08K5/14 , C08K5/3415 , C08L61/14
Abstract: Provided is a thermosetting resin composition which exhibits excellent workability, and which is capable of obtaining, as a result of being cured, a highly reliable cured product (molded article) exhibiting excellent heat resistance and mechanical strength. This thermosetting resin composition includes: a polyalkenyl phenol resin (A); an aromatic polymaleimide compound (B); and a polymerization initiator (C). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (al) which has a phenolic hydroxyl group having a 2-alkenyl group bonded thereto, and at least one aromatic ring unit (a2) having a phenolic hydroxyl group which does not have a 2-alkenyl group bonded thereto. Each of the aromatic ring units is bonded by a linking group having a main chain which is not formed by an aromatic ring. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of m to (m+n) is 40-90%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).
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公开(公告)号:US20210284783A1
公开(公告)日:2021-09-16
申请号:US16319675
申请日:2017-05-25
Applicant: SHOWA DENKO K.K.
Inventor: Aoi HASEGAWA , Chika YAMASHITA , Yoshitaka ISHIBASHI , Tomonori TAJIMA , Hiromi OTAKE
IPC: C08G8/30 , C08K5/3415
Abstract: Provided are a curable resin mixture and a curable resin composition which contain a polyalkenylphenol resin and an aromatic polymaleimide compound having high crystallinity and a high melting point, and which exhibit excellent fluidity and reactivity. Also provided is a method for producing a curable resin mixture that contains: (A) a polyalkenylphenol resin which contains a polyalkenylphenol compound having at least 2 phenol skeletons in the molecule, a prescribed 2-alkenyl group being bonded to some or all of aromatic rings that form the phenol skeletons in the molecule; and (B) an aromatic polymaleimide compound. The method comprises: heating the aromatic polymaleimide compound (B) to the melting point or above and thereby melting the compound; and mixing the molten aromatic polymaleimide compound (B) and the polyalkenylphenol resin (A) within a temperature range at which the aromatic polymaleimide compound (B) does not recrystallize.
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公开(公告)号:US20180282494A1
公开(公告)日:2018-10-04
申请号:US15531587
申请日:2015-12-11
Applicant: SHOWA DENKO K.K.
Inventor: Hiromi OTAKE , Aoi NAKANO , Chika YAMASHITA , Yoshitaka ISHIBASHI , Hiroshi UCHIDA
Abstract: Provided is a thermosetting resin composition which is capable of obtaining, as a result of being cured, a highly reliable cured product exhibiting excellent moisture resistance, heat resistance, and mechanical strength. The present invention includes a polyalkenyl phenol resin (A) and an aromatic polymaleimide compound (B). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (a1) which has or does not have a 2-alkenyl group bonded thereto, and in which a phenolic hydroxyl group is alkyl-etherified, and at least one aromatic ring unit (a2) which has a phenolic hydroxyl group, and which has or does not have a 2-alkenyl group bonded thereto. At least one of the aromatic ring units (a1, a2) has a 2-alkenyl group. Each of the aromatic ring units is bonded by a linking group. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of n to (m+n) is 10-60%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).
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公开(公告)号:US20170342042A1
公开(公告)日:2017-11-30
申请号:US15526161
申请日:2015-10-28
Applicant: SHOWA DENKO K.K.
Inventor: Chika YAMASHITA , Yoshitaka ISHIBASHI
IPC: C07D301/12
CPC classification number: C07D301/12 , C07D301/03 , C07D303/12 , C07D303/28
Abstract: A polyvalent glycidyl compound is produced from a compound having one or more 2-alkenyl ether groups and two or more 2-alkenyl groups using a hydrogen peroxide aqueous solution as an oxidizing agent to oxidize the 2-alkenyl ether groups and the 2-alkenyl groups. A 2-alkenyl ether compound having two or more (un)substituted 2-alkenyl groups and one or more (un)substituted 2-alkenyl ether groups is oxidized using a hydrogen peroxide aqueous solution as an oxidizing agent in the presence of a tungsten compound and a quaternary ammonium salt as catalysts and of phosphoric acid as a co-catalyst, while controlling the pH of the reaction solution to 1.0-4.0 using an acid other than phosphoric acid. During the oxidation, the step of adding the hydrogen peroxide aqueous solution to the reaction solution and the step of adding the acid other than phosphoric acid thereto are alternately repeated at intervals two or more times.
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