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    THERMOSETTING RESIN COMPOSITION
    2.
    发明申请
    THERMOSETTING RESIN COMPOSITION 审中-公开

    公开(公告)号：US20180282494A1

    公开(公告)日：2018-10-04

    申请号：US15531587

    申请日：2015-12-11

    Applicant: SHOWA DENKO K.K.

    Inventor： Hiromi OTAKE ,  Aoi NAKANO ,  Chika YAMASHITA ,  Yoshitaka ISHIBASHI ,  Hiroshi UCHIDA

    IPC: C08J3/24 ,  C08G8/32 ,  C08K3/36

    Abstract: Provided is a thermosetting resin composition which is capable of obtaining, as a result of being cured, a highly reliable cured product exhibiting excellent moisture resistance, heat resistance, and mechanical strength. The present invention includes a polyalkenyl phenol resin (A) and an aromatic polymaleimide compound (B). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (a1) which has or does not have a 2-alkenyl group bonded thereto, and in which a phenolic hydroxyl group is alkyl-etherified, and at least one aromatic ring unit (a2) which has a phenolic hydroxyl group, and which has or does not have a 2-alkenyl group bonded thereto. At least one of the aromatic ring units (a1, a2) has a 2-alkenyl group. Each of the aromatic ring units is bonded by a linking group. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of n to (m+n) is 10-60%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).

    PROCESS FOR PRODUCING POLYVALENT GLYCIDYL COMPOUND
    3.
    发明申请
    PROCESS FOR PRODUCING POLYVALENT GLYCIDYL COMPOUND 审中-公开

    公开(公告)号：US20170342042A1

    公开(公告)日：2017-11-30

    申请号：US15526161

    申请日：2015-10-28

    Applicant: SHOWA DENKO K.K.

    Inventor： Chika YAMASHITA ,  Yoshitaka ISHIBASHI

    IPC: C07D301/12

    CPC classification number: C07D301/12 ,  C07D301/03 ,  C07D303/12 ,  C07D303/28

    Abstract: A polyvalent glycidyl compound is produced from a compound having one or more 2-alkenyl ether groups and two or more 2-alkenyl groups using a hydrogen peroxide aqueous solution as an oxidizing agent to oxidize the 2-alkenyl ether groups and the 2-alkenyl groups. A 2-alkenyl ether compound having two or more (un)substituted 2-alkenyl groups and one or more (un)substituted 2-alkenyl ether groups is oxidized using a hydrogen peroxide aqueous solution as an oxidizing agent in the presence of a tungsten compound and a quaternary ammonium salt as catalysts and of phosphoric acid as a co-catalyst, while controlling the pH of the reaction solution to 1.0-4.0 using an acid other than phosphoric acid. During the oxidation, the step of adding the hydrogen peroxide aqueous solution to the reaction solution and the step of adding the acid other than phosphoric acid thereto are alternately repeated at intervals two or more times.

    CURING ACCELERATOR AND RADICAL POLYMERIZABLE RESIN COMPOSITION
    4.
    发明申请
    CURING ACCELERATOR AND RADICAL POLYMERIZABLE RESIN COMPOSITION 审中-公开

    公开(公告)号：US20200181365A1

    公开(公告)日：2020-06-11

    申请号：US16341151

    申请日：2017-09-04

    Applicant: SHOWA DENKO K.K.

    Inventor： Yoichiro SAKAGUCHI ,  Takuya MINAMI ,  Yoshishige OKUNO ,  Atsushi UMINO ,  Yoshitaka ISHIBASHI

    IPC: C08K5/548 ,  C08F20/00

    Abstract: A curing accelerator can exhibit good curing acceleration performance and is excellent in storage stability, while maintaining sufficient pot life in a curing reaction of radical-polymerizable resins, and a radical-polymerizable resin composition uses the curing accelerator. The curing accelerator for radical-polymerizable resins includes a metal-containing compound (A), a thiol compound (B) and an aprotic solvent (C) having a dielectric constant of 10 or less, wherein the metal-containing compound (A) is one or more compounds selected from a metal soap (A1) and a β-diketone skeleton-having metal complex (A2), the thiol compound (B) is one or more compounds selected from a mono-functional primary thiol compound (B1), a secondary thiol compound (B2) and a tertiary thiol compound (B3), and the content of the aprotic solvent (C) is 10 to 1,000 parts by mass relative to 100 parts by mass of the total of the metal-containing compound (A) and the thiol compound (B).

    THERMOSETTING RESIN COMPOSITION
    6.
    发明申请
    THERMOSETTING RESIN COMPOSITION 审中-公开

    公开(公告)号：US20170349743A1

    公开(公告)日：2017-12-07

    申请号：US15533549

    申请日：2015-12-11

    Applicant: SHOWA DENKO K.K.

    Inventor： Hiromi OTAKE ,  Aoi NAKANO ,  Chika YAMASHITA ,  Yoshitaka ISHIBASHI ,  Hiroshi UCHIDA

    IPC: C08L61/16 ,  C08K5/14 ,  C08F290/14

    CPC classification number: C08L61/16 ,  C08F290/14 ,  C08K3/00 ,  C08K5/14 ,  C08K5/3415 ,  C08L61/14

    Abstract: Provided is a thermosetting resin composition which exhibits excellent workability, and which is capable of obtaining, as a result of being cured, a highly reliable cured product (molded article) exhibiting excellent heat resistance and mechanical strength. This thermosetting resin composition includes: a polyalkenyl phenol resin (A); an aromatic polymaleimide compound (B); and a polymerization initiator (C). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (al) which has a phenolic hydroxyl group having a 2-alkenyl group bonded thereto, and at least one aromatic ring unit (a2) having a phenolic hydroxyl group which does not have a 2-alkenyl group bonded thereto. Each of the aromatic ring units is bonded by a linking group having a main chain which is not formed by an aromatic ring. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of m to (m+n) is 40-90%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).

    METHODS FOR PRODUCING CURABLE RESIN MIXTURE AND CURABLE RESIN COMPOSITION
    7.
    发明申请
    METHODS FOR PRODUCING CURABLE RESIN MIXTURE AND CURABLE RESIN COMPOSITION 有权

    公开(公告)号：US20210284783A1

    公开(公告)日：2021-09-16

    申请号：US16319675

    申请日：2017-05-25

    Applicant: SHOWA DENKO K.K.

    Inventor： Aoi HASEGAWA ,  Chika YAMASHITA ,  Yoshitaka ISHIBASHI ,  Tomonori TAJIMA ,  Hiromi OTAKE

    IPC: C08G8/30 ,  C08K5/3415

    Abstract: Provided are a curable resin mixture and a curable resin composition which contain a polyalkenylphenol resin and an aromatic polymaleimide compound having high crystallinity and a high melting point, and which exhibit excellent fluidity and reactivity. Also provided is a method for producing a curable resin mixture that contains: (A) a polyalkenylphenol resin which contains a polyalkenylphenol compound having at least 2 phenol skeletons in the molecule, a prescribed 2-alkenyl group being bonded to some or all of aromatic rings that form the phenol skeletons in the molecule; and (B) an aromatic polymaleimide compound. The method comprises: heating the aromatic polymaleimide compound (B) to the melting point or above and thereby melting the compound; and mixing the molten aromatic polymaleimide compound (B) and the polyalkenylphenol resin (A) within a temperature range at which the aromatic polymaleimide compound (B) does not recrystallize.

    CONDUCTIVE ADHESIVE, ANISOTROPIC CONDUCTIVE FILM AND ELECTRONIC DEVICES USING BOTH
    9.
    发明申请
    CONDUCTIVE ADHESIVE, ANISOTROPIC CONDUCTIVE FILM AND ELECTRONIC DEVICES USING BOTH 有权
    导电胶，异相导电胶片和电子设备

    公开(公告)号：US20160060490A1

    公开(公告)日：2016-03-03

    申请号：US14781746

    申请日：2014-03-27

    Applicant: SHOWA DENKO K.K.

    Inventor： Hiroshi UCHIDA ,  Yoshitaka ISHIBASHI

    IPC: C09J9/02 ,  C09J133/14 ,  C09J7/00

    CPC classification number: C09J9/02 ,  C08K3/08 ,  C08K7/18 ,  C08K2003/0806 ,  C08K2003/0831 ,  C08K2003/085 ,  C08K2003/0862 ,  C09D133/068 ,  C09J7/00 ,  C09J7/10 ,  C09J133/14 ,  C09J163/10 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01B1/22

    Abstract: [Problem] To provide: a conductive adhesive which contains an epoxy (meth)acrylate resin and which can form a bonded zone that is not susceptible to being deteriorated by halogen; an anisotropic conductive film; and electronic devices using both. [Solution] A conductive adhesive and an anisotropic conductive film which each contain a conductive filler and a binder resin, wherein: the binder resin comprises an epoxy (meth)acrylate resin that is a product of addition reaction of (meth)acrylic acid and an epoxy compound having a sum of total chlorine atom concentration and total bromine atom concentration of 300 massppm or less, preferably 50 massppm or less; and the conductive filler is dispersed in the binder resin which comprises such an epoxy (meth)acrylate resin. The epoxy (meth)acrylate resin is preferably prepared by subjecting a starting compound (substrate) having a carbon-carbon double bond to epoxidation of the double bond with an oxidizing agent consisting of hydrogen peroxide, and then subjecting the obtained epoxy compound to addition reaction with (meth)acrylic acid.

    Abstract translation: [问题]提供：含有环氧（甲基）丙烯酸酯树脂的导电性粘合剂，其可以形成不易被卤素劣化的结合区域; 各向异性导电膜; 和使用两者的电子设备。 [解决方案]导电性粘合剂和各向异性导电膜，其各自含有导电性填料和粘合剂树脂，其中：所述粘合剂树脂包含环氧（甲基）丙烯酸酯树脂，其是（甲基）丙烯酸与 总氯原子浓度和总溴原子浓度之和为300质量ppm以下，优选为50质量ppm以下的环氧化合物; 并且导电填料分散在包含这种环氧（甲基）丙烯酸酯树脂的粘合剂树脂中。 环氧（甲基）丙烯酸酯树脂优选通过使具有碳 - 碳双键的原料化合物（底物）与由过氧化氢组成的氧化剂进行环氧化反应制备，然后将所得环氧化合物进行加成反应 与（甲基）丙烯酸。

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