公开(公告)号：US20170349743A1

公开(公告)日：2017-12-07

申请号：US15533549

申请日：2015-12-11

Applicant: SHOWA DENKO K.K.

Inventor： Hiromi OTAKE ,  Aoi NAKANO ,  Chika YAMASHITA ,  Yoshitaka ISHIBASHI ,  Hiroshi UCHIDA

IPC: C08L61/16 ,  C08K5/14 ,  C08F290/14

CPC classification number: C08L61/16 ,  C08F290/14 ,  C08K3/00 ,  C08K5/14 ,  C08K5/3415 ,  C08L61/14

Abstract: Provided is a thermosetting resin composition which exhibits excellent workability, and which is capable of obtaining, as a result of being cured, a highly reliable cured product (molded article) exhibiting excellent heat resistance and mechanical strength. This thermosetting resin composition includes: a polyalkenyl phenol resin (A); an aromatic polymaleimide compound (B); and a polymerization initiator (C). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (al) which has a phenolic hydroxyl group having a 2-alkenyl group bonded thereto, and at least one aromatic ring unit (a2) having a phenolic hydroxyl group which does not have a 2-alkenyl group bonded thereto. Each of the aromatic ring units is bonded by a linking group having a main chain which is not formed by an aromatic ring. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of m to (m+n) is 40-90%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).

公开(公告)号：US20210284783A1

公开(公告)日：2021-09-16

申请号：US16319675

申请日：2017-05-25

Applicant: SHOWA DENKO K.K.

Inventor： Aoi HASEGAWA ,  Chika YAMASHITA ,  Yoshitaka ISHIBASHI ,  Tomonori TAJIMA ,  Hiromi OTAKE

IPC: C08G8/30 ,  C08K5/3415

Abstract: Provided are a curable resin mixture and a curable resin composition which contain a polyalkenylphenol resin and an aromatic polymaleimide compound having high crystallinity and a high melting point, and which exhibit excellent fluidity and reactivity. Also provided is a method for producing a curable resin mixture that contains: (A) a polyalkenylphenol resin which contains a polyalkenylphenol compound having at least 2 phenol skeletons in the molecule, a prescribed 2-alkenyl group being bonded to some or all of aromatic rings that form the phenol skeletons in the molecule; and (B) an aromatic polymaleimide compound. The method comprises: heating the aromatic polymaleimide compound (B) to the melting point or above and thereby melting the compound; and mixing the molten aromatic polymaleimide compound (B) and the polyalkenylphenol resin (A) within a temperature range at which the aromatic polymaleimide compound (B) does not recrystallize.

公开(公告)号：US20180282494A1

公开(公告)日：2018-10-04

申请号：US15531587

申请日：2015-12-11

Applicant: SHOWA DENKO K.K.

Inventor： Hiromi OTAKE ,  Aoi NAKANO ,  Chika YAMASHITA ,  Yoshitaka ISHIBASHI ,  Hiroshi UCHIDA

IPC: C08J3/24 ,  C08G8/32 ,  C08K3/36

Abstract: Provided is a thermosetting resin composition which is capable of obtaining, as a result of being cured, a highly reliable cured product exhibiting excellent moisture resistance, heat resistance, and mechanical strength. The present invention includes a polyalkenyl phenol resin (A) and an aromatic polymaleimide compound (B). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (a1) which has or does not have a 2-alkenyl group bonded thereto, and in which a phenolic hydroxyl group is alkyl-etherified, and at least one aromatic ring unit (a2) which has a phenolic hydroxyl group, and which has or does not have a 2-alkenyl group bonded thereto. At least one of the aromatic ring units (a1, a2) has a 2-alkenyl group. Each of the aromatic ring units is bonded by a linking group. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of n to (m+n) is 10-60%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).