公开(公告)号：US20240052223A1

公开(公告)日：2024-02-15

申请号：US17793762

申请日：2022-01-28

Applicant: SHOWA DENKO K.K.

Inventor： Hajime FUNAHASHI ,  Naoki MINORIKAWA ,  Hikaru SATOH ,  Ikue KOBAYASHI ,  Hajime YUKUTAKE ,  Takeshi IEMURA

IPC: C09K5/14 ,  C08G18/36 ,  C08G18/10 ,  C08K9/02 ,  C08K9/08 ,  C08K3/22

CPC classification number: C09K5/14 ,  C08G18/36 ,  C08G18/10 ,  C08K9/02 ,  C08K9/08 ,  C08K3/22 ,  C08K2201/001 ,  C08K2201/01 ,  C08K2201/005 ,  C08K2003/2227 ,  C08K2201/014 ,  H01L23/3737

Abstract: A thermally conductive urethane resin composition comprising a castor oil-based polyol, a polyisocyanate compound, and a filler, wherein



an equivalent ratio [NCO/OH] of isocyanato groups of the polyisocyanate compound to hydroxyl groups of the castor oil-based polyol is from 0.8 to 1.6,
the filler comprises a filler (A) having an average particle diameter of 0.03 to 10 μm, and
the filler (A) has been surface-treated with a specific surface treatment agent.

公开(公告)号：US20220195141A1

公开(公告)日：2022-06-23

申请号：US17601459

申请日：2020-07-09

Applicant: SHOWA DENKO K.K.

Inventor： Naoki MINORIKAWA ,  Ikue KOBAYASHI ,  Yuki OTSUKA

IPC: C08K3/36 ,  C01B21/064 ,  C08K9/10

Abstract: A method of manufacturing a silica-coated boron nitride particle including a first step of covering the surface of the boron nitride particle with an organic silicone compound having a specific structure and a second step of heating the boron nitride particle covered with the organic silicone compound at a temperature of 500° C. or more and 1000° C. or less, wherein the content of carbon atoms in the silica-coated boron nitride particle is 1000 ppm by mass or less. Also disclosed is a method of manufacturing a heat dissipating resin composition containing the silica-coated boron nitride particle; and silica-coated boron nitride particles.