公开(公告)号：US20240052223A1

公开(公告)日：2024-02-15

申请号：US17793762

申请日：2022-01-28

Applicant: SHOWA DENKO K.K.

Inventor： Hajime FUNAHASHI ,  Naoki MINORIKAWA ,  Hikaru SATOH ,  Ikue KOBAYASHI ,  Hajime YUKUTAKE ,  Takeshi IEMURA

IPC: C09K5/14 ,  C08G18/36 ,  C08G18/10 ,  C08K9/02 ,  C08K9/08 ,  C08K3/22

CPC classification number: C09K5/14 ,  C08G18/36 ,  C08G18/10 ,  C08K9/02 ,  C08K9/08 ,  C08K3/22 ,  C08K2201/001 ,  C08K2201/01 ,  C08K2201/005 ,  C08K2003/2227 ,  C08K2201/014 ,  H01L23/3737

Abstract: A thermally conductive urethane resin composition comprising a castor oil-based polyol, a polyisocyanate compound, and a filler, wherein



an equivalent ratio [NCO/OH] of isocyanato groups of the polyisocyanate compound to hydroxyl groups of the castor oil-based polyol is from 0.8 to 1.6,
the filler comprises a filler (A) having an average particle diameter of 0.03 to 10 μm, and
the filler (A) has been surface-treated with a specific surface treatment agent.

公开(公告)号：US20220119619A1

公开(公告)日：2022-04-21

申请号：US17434578

申请日：2020-07-30

Applicant: SHOWA DENKO K.K.

Inventor： Hajime YUKUTAKE ,  Yuki OTSUKA ,  Naoki MINORIKAWA ,  Hidetoshi OKAMOTO ,  Toshihiro ARAI

IPC: C08K3/22 ,  C08K3/28 ,  C08L83/04 ,  C08K9/06

Abstract: An inorganic particle dispersion resin composition, containing: a resin; and inorganic particles, in which the inorganic particles include silica-covered aluminum nitride particles and alumina particles, and the silica-covered aluminum nitride particles include aluminum nitride particles and a silica film covering surfaces of the aluminum nitride particles. A total content of the inorganic particles is preferably in a range of greater than or equal to 60.0 volume % and less than or equal to 85.0 volume %.

公开(公告)号：US20210309861A1

公开(公告)日：2021-10-07

申请号：US17270202

申请日：2019-08-23

Applicant: SHOWA DENKO K.K.

Inventor： Yuki OTSUKA ,  Hidetoshi OKAMOTO ,  Naoki MINORIKAWA

IPC: C09C3/12 ,  C09C1/40

Abstract: A method of manufacturing a silicon-containing oxide-coated aluminum nitride particle; a method of manufacturing a heat dispersing resin composition containing the silicon-containing oxide-coated aluminum nitride particle; and the silicon-containing oxide-coated aluminum nitride particle. The method of manufacturing includes: a first step of covering the surface of the aluminum nitride particle with an organic silicone compound including a specific structure; and a second step of heating the aluminum nitride particle covered with the organic silicone compound at a temperature of 300° C. or more and less than 1000° C., wherein the content of carbon atoms in the silicon-containing oxide-coated aluminum nitride particle is less than 1000 ppm by mass.

公开(公告)号：US20230227707A1

公开(公告)日：2023-07-20

申请号：US18001619

申请日：2021-05-11

Applicant: SHOWA DENKO K.K.

Inventor： Hajime YUKUTAKE ,  Naoki MINORIKAWA ,  Hajime FUNAHASHI

IPC: C09K5/14 ,  C08L83/04 ,  C08K13/06

CPC classification number: C09K5/14 ,  C08L83/04 ,  C08K13/06 ,  C08L2207/324 ,  C08L2205/025 ,  C08K2003/282

Abstract: Provided is a thermally conductive composition containing a liquid resin, a thermally conductive powder, and a dispersant, in which the liquid resin has a viscosity of 10 mPa·s or more and 2,000 mPa·s or less at 25° C., the dispersant is an acrylic silicone, and at least one of the liquid resin and the thermally conductive powder contains an alkyl group having 4 or more carbon atoms.

公开(公告)号：US20220195141A1

公开(公告)日：2022-06-23

申请号：US17601459

申请日：2020-07-09

Applicant: SHOWA DENKO K.K.

Inventor： Naoki MINORIKAWA ,  Ikue KOBAYASHI ,  Yuki OTSUKA

IPC: C08K3/36 ,  C01B21/064 ,  C08K9/10

Abstract: A method of manufacturing a silica-coated boron nitride particle including a first step of covering the surface of the boron nitride particle with an organic silicone compound having a specific structure and a second step of heating the boron nitride particle covered with the organic silicone compound at a temperature of 500° C. or more and 1000° C. or less, wherein the content of carbon atoms in the silica-coated boron nitride particle is 1000 ppm by mass or less. Also disclosed is a method of manufacturing a heat dissipating resin composition containing the silica-coated boron nitride particle; and silica-coated boron nitride particles.