公开(公告)号：US10899897B2

公开(公告)日：2021-01-26

申请号：US15749181

申请日：2016-07-21

Applicant: SHOWA DENKO K.K.

Inventor： Ryujin Ishiuchi

IPC: C08J5/12 ,  C08F283/01 ,  C08F290/06 ,  B29C65/00 ,  B29C65/06 ,  B29C65/82 ,  B29C65/44 ,  B32B15/08 ,  B29C65/64 ,  B23K20/12 ,  C08J5/04

Abstract: A friction stir welding method using a resin composition including: a monomer (A) having an ethylenically unsaturated bond; a thermosetting resin (B); a radical polymerization initiator (C); and a fiber reinforcing material (D), wherein the thermosetting resin (B) is an unsaturated polyester resin or a vinyl ester resin.

公开(公告)号：US11873399B2

公开(公告)日：2024-01-16

申请号：US16977719

申请日：2019-01-21

Applicant: SHOWA DENKO K.K.

Inventor： Ryujin Ishiuchi ,  Nobuyuki Takahashi

IPC: C08L67/07 ,  B24B37/24 ,  C08L33/10 ,  B24D18/00 ,  C08F283/01 ,  C08F290/06 ,  C08L51/08

CPC classification number: C08L67/07 ,  B24B37/24 ,  C08L33/10

Abstract: Provided are: a resin composition for easily giving polishing pads which have a hardness suitable for chemical mechanical polishing and have voids of a desired size; a polishing pad produced from the resin composition; and a method for producing the polishing pad. The resin composition comprises a urethane (meth)acrylate (A), at least one unsaturated resin (B) selected from among vinyl ester resins and unsaturated polyester resins, an ethylenically unsaturated compound (C) which has an ethylenically unsaturated bond and is neither the urethane (meth)acrylate (A) nor the unsaturated resin (B), and a hollow object (D), wherein the mass ratio of the content of the urethane (meth)acrylate (A) to the content of the unsaturated resin (B), A:B, is 64:36 to 96:4 and the content of the hollow object (D) is 0.7-9.0 parts by mass per 100 parts by mass of the sum of the urethane (meth)acrylate (A), the unsaturated resin (B), and the ethylenically unsaturated compound (C).

公开(公告)号：US10789930B2

公开(公告)日：2020-09-29

申请号：US15531477

申请日：2015-12-11

Applicant: SHOWA DENKO K.K.

Inventor： Nobuyuki Takahashi ,  Ryujin Ishiuchi ,  Shotaro Itami

IPC: G10K11/165 ,  E04B1/86 ,  E01F8/00 ,  G10K11/16 ,  E04B9/04 ,  B29C39/00 ,  B29K31/00 ,  B29K67/00 ,  B29K509/00

Abstract: This invention is concerning a structure body containing inorganic particles having an average particle diameter of 6 mm to 50 mm, and 6 parts by mass to 40 parts by mass of a resin with respect to 100 parts by mass of the inorganic particles.

公开(公告)号：US09518205B2

公开(公告)日：2016-12-13

申请号：US14358495

申请日：2012-12-13

Applicant: SHOWA DENKO K.K. ,  TOYOTA JIDOSHA KABUSHIKI KAISHA

Inventor： Shotaro Itami ,  Masashige Tanaka ,  Hiroyuki Majima ,  Ryujin Ishiuchi ,  Hiroaki Sugita

IPC: C08F283/01 ,  C09K5/14 ,  H02K5/02 ,  H02K3/30 ,  H02K5/08

CPC classification number: C09K5/14 ,  C08F283/01 ,  H02K3/30 ,  H02K5/02 ,  H02K5/08 ,  C08F222/10

Abstract: The present invention is an unsaturated polyester resin composition comprising an unsaturated polyester (a), a monomer (b) having one polymerizable carbon-carbon double bond, a monomer (c) having two or more of (meth)acrylate groups, a filler (d) having high thermal conductivity, a glass fiber (e), a low profile additive (f), a curing agent (g), and a polymerization inhibitor (h), wherein the ratio by weight of the ingredient (b) to the ingredient (c) is from 50:50 to 75:25 and the unsaturated polyester resin composition comprises 400 to 1400 parts by weight of the ingredient (d) based on the total 100 parts by weight of the ingredients (a), (b), and (c). This unsaturated polyester resin composition has excellent curing properties without losing storage stability which can be used to provide a cured product having a low mold shrinkage ratio and high thermal conductivity.

Abstract translation: 本发明是一种不饱和聚酯树脂组合物，其包含不饱和聚酯（a），具有一个可聚合碳 - 碳双键的单体（b），具有两个或多个（甲基）丙烯酸酯基团的单体（c），填料（ d）具有高导热性，玻璃纤维（e），低轮廓添加剂（f），固化剂（g）和阻聚剂（h）），其中成分（b）与 成分（c）为50:50至75:25，并且不饱和聚酯树脂组合物包含基于成分（a），（b）的总计100重量份的400至1400重量份的成分（d） ，和（c）。 这种不饱和聚酯树脂组合物具有优异的固化性能而不失去储存稳定性，可用于提供具有低模塑收缩率和高导热性的固化产物。

公开(公告)号：US20140332712A1

公开(公告)日：2014-11-13

申请号：US14358495

申请日：2012-12-13

Applicant: SHOWA DENKO K.K. ,  TOYOTA JIDOSHA KABUSHIKI KAISHA

Inventor： Shotaro Itami ,  Masashige Tanaka ,  Hiroyuki Majima ,  Ryujin Ishiuchi ,  Hiroaki Sugita

IPC: C09K5/14 ,  H02K3/30

CPC classification number: C09K5/14 ,  C08F283/01 ,  H02K3/30 ,  H02K5/02 ,  H02K5/08 ,  C08F222/10

Abstract: The present invention is an unsaturated polyester resin composition comprising an unsaturated polyester (a), a monomer (b) having one polymerizable carbon-carbon double bond, a monomer (c) having two or more of (meth)acrylate groups, a filler (d) having high thermal conductivity, a glass fiber (e), a low profile additive (f), a curing agent (g), and a polymerization inhibitor (h), wherein the ratio by weight of the ingredient (b) to the ingredient (c) is from 50:50 to 75:25 and the unsaturated polyester resin composition comprises 400 to 1400 parts by weight of the ingredient (d) based on the total 100 parts by weight of the ingredients (a), (b), and (c). This unsaturated polyester resin composition has excellent curing properties without losing storage stability which can be used to provide a cured product having a low mold shrinkage ratio and high thermal conductivity.

Abstract translation: 本发明是一种不饱和聚酯树脂组合物，其包含不饱和聚酯（a），具有一个可聚合碳 - 碳双键的单体（b），具有两个或多个（甲基）丙烯酸酯基团的单体（c），填料（ d）具有高导热性，玻璃纤维（e），低轮廓添加剂（f），固化剂（g）和阻聚剂（h）），其中成分（b）与 成分（c）为50:50至75:25，并且不饱和聚酯树脂组合物包含基于成分（a），（b）的总计100重量份的400至1400重量份的成分（d） ，和（c）。 这种不饱和聚酯树脂组合物具有优异的固化性能而不失去储存稳定性，可用于提供具有低模塑收缩率和高导热性的固化产物。